AMD Xilinx
XQV600E-6BG432N
XQV600E-6BG432N ECAD Model
XQV600E-6BG432N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 316 | |
| Number of Outputs | 316 | |
| Number of Logic Cells | 15552 | |
| Number of Equivalent Gates | 985882 | |
| Number of CLBs | 3456 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | 38535Q/M;38534H;883B | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3456 CLBS, 985882 GATES | |
| Clock Frequency-Max | 357.2 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA432,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-432 | |
| Pin Count | 432 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.39.00.01 |
XQV600E-6BG432N Datasheet Download
XQV600E-6BG432N Overview
The chip model XQV600E-6BG432N is a powerful and high-performance device designed for digital signal processing, embedded processing, and image processing. It is capable of performing complex calculations and operations, and is capable of handling large amounts of data quickly and accurately. The chip model is designed to be used with the HDL language, allowing for efficient and effective programming.
The original design intention of the chip model XQV600E-6BG432N was to create a high-performance device that could be used in a variety of applications, such as digital signal processing, embedded processing, and image processing. The chip model is also capable of being upgraded to handle more complex tasks and processes as technology advances. This makes it an ideal choice for high-performance applications, such as advanced communication systems.
The chip model XQV600E-6BG432N can also be applied to the development and popularization of future intelligent robots. It is capable of performing complex calculations and operations, and can handle large amounts of data quickly and accurately, making it an ideal choice for robotics applications. To use the model effectively, technical talents such as computer scientists, software engineers, and hardware engineers are needed to create effective and efficient programs.
In conclusion, the chip model XQV600E-6BG432N is a powerful and high-performance device designed for digital signal processing, embedded processing, and image processing. It is capable of performing complex calculations and operations, and is capable of handling large amounts of data quickly and accurately. The chip model is designed to be used with the HDL language, allowing for efficient and effective programming. It is also capable of being upgraded to handle more complex tasks and processes as technology advances, making it an ideal choice for high-performance applications, such as advanced communication systems. Furthermore, it can also be applied to the development and popularization of future intelligent robots. To use the model effectively, technical talents such as computer scientists, software engineers, and hardware engineers are needed to create effective and efficient programs.
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