AMD Xilinx
XQV600-4BG432N
XQV600-4BG432N ECAD Model
XQV600-4BG432N Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 316 | |
| Number of Outputs | 316 | |
| Number of Logic Cells | 15552 | |
| Number of Equivalent Gates | 661111 | |
| Number of CLBs | 3456 | |
| Combinatorial Delay of a CLB-Max | 800 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | MIL-PRF-38535 | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3456 CLBS, 661111 GATES | |
| Power Supplies | 1.2/3.6,2.5 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA432,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-432 | |
| Pin Count | 432 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.39.00.01 |
XQV600-4BG432N Datasheet Download
XQV600-4BG432N Overview
The chip model XQV600-4BG432N is a powerful and versatile processor, suitable for a variety of high-performance digital signal processing, embedded processing, and image processing applications. It is designed to be used with the HDL language, making it an ideal choice for developers looking to create complex and sophisticated systems.
In the future, the XQV600-4BG432N chip model could be used in networks and a variety of intelligent scenarios. It has the potential to be used in the era of fully intelligent systems, allowing developers to create powerful and efficient systems that can process large amounts of data. It could also be used to develop and popularize future intelligent robots, allowing for the creation of machines that can interact with their environment and perform complex tasks.
To use the XQV600-4BG432N chip model effectively, developers will need to possess a range of technical skills. This includes a deep understanding of the HDL language and the ability to use it to create complex systems. Developers will also need to understand the principles of digital signal processing, embedded processing, and image processing, as well as the algorithms and techniques used to create intelligent systems.
The XQV600-4BG432N chip model is a powerful and versatile processor, capable of performing a range of complex tasks. With the right technical skills, developers can use it to create powerful and efficient systems that can be used in networks and a variety of intelligent scenarios. It also has the potential to be used in the era of fully intelligent systems and to develop and popularize future intelligent robots.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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