AMD Xilinx
XQV2000E-6BG560N
XQV2000E-6BG560N ECAD Model
XQV2000E-6BG560N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 404 | |
| Number of Outputs | 404 | |
| Number of Logic Cells | 43200 | |
| Number of Equivalent Gates | 2541952 | |
| Number of CLBs | 9600 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | 38535Q/M;38534H;883B | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 9600 CLBS, 2541952 GATES | |
| Clock Frequency-Max | 357.2 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.39.00.01 |
XQV2000E-6BG560N Datasheet Download
XQV2000E-6BG560N Overview
The chip model XQV2000E-6BG560N is a high-performance digital signal processor (DSP) that is suitable for a variety of applications, including embedded processing, image processing, and other areas. It is designed to be used with the HDL language, which is a hardware description language that is used to create hardware designs.
The XQV2000E-6BG560N has several advantages that make it a great choice for a variety of applications. It has a high-speed clock rate, which allows it to process data quickly and efficiently. It also has a large memory, which allows for the storage of large amounts of data. Additionally, it has a low power consumption, which helps to reduce costs associated with running the chip.
The expected demand for the XQV2000E-6BG560N is likely to increase in the future, as more applications are developed that require the use of a DSP. The chip is likely to be used in a variety of industries, including automotive, industrial, and medical. Additionally, the chip is likely to be used in the development of intelligent robots, as it allows for the processing of complex data quickly and efficiently.
Using the XQV2000E-6BG560N effectively requires certain technical talents. It requires a deep understanding of the HDL language, as well as a knowledge of the chip’s design and architecture. Additionally, it requires a knowledge of the applications that the chip is being used for, as well as the algorithms that are used to process the data.
In conclusion, the chip model XQV2000E-6BG560N is a great choice for a variety of applications, including embedded processing, image processing, and the development of intelligent robots. It offers several advantages, including a high-speed clock rate, large memory, and low power consumption. Additionally, the expected demand for the chip is likely to increase in the future, and those who wish to use it effectively need to have certain technical talents.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||