AMD Xilinx
XQV1000E-6BG560N
XQV1000E-6BG560N ECAD Model
XQV1000E-6BG560N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 404 | |
| Number of Outputs | 404 | |
| Number of Logic Cells | 27648 | |
| Number of Equivalent Gates | 1569178 | |
| Number of CLBs | 6144 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | 38535Q/M;38534H;883B | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6144 CLBS, 1569178 GATES | |
| Clock Frequency-Max | 357.2 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.39.00.01 |
XQV1000E-6BG560N Datasheet Download
XQV1000E-6BG560N Overview
The XQV1000E-6BG560N chip model is a high-performance digital signal processor, embedded processor, and image processor, making it suitable for a wide range of applications. It is designed to be programmed with the hardware description language (HDL), which is a language that allows users to easily design and implement digital logic circuits.
The chip model XQV1000E-6BG560N is widely used in the industry and is expected to continue to be used in the future. Its application environment may require the support of new technologies, such as the Internet of Things (IoT) and artificial intelligence (AI). With the advancement of technology, these new technologies can be used to enhance the performance of the chip model and enable it to be used in more scenarios.
When it comes to product description and design requirements of the chip model XQV1000E-6BG560N, it is important to consider the actual use case and ensure that the design meets the needs of the user. The design should also take into account the safety and reliability of the chip model as well as any potential risks. Additionally, the design should be able to handle the data processing needs of the user and make sure that the chip model is able to perform the tasks required.
Case studies can also be used to better understand the application of the chip model XQV1000E-6BG560N. These studies can provide valuable insights into the design process and help users to make informed decisions about the design. Additionally, users should also take into account any potential risks and make sure that the design is able to meet the needs of the user.
In conclusion, the XQV1000E-6BG560N chip model is a high-performance digital signal processor, embedded processor, and image processor, making it suitable for a wide range of applications. It is designed to be programmed with the hardware description language (HDL), which is a language that allows users to easily design and implement digital logic circuits. The application environment of the chip model may require the support of new technologies, such as the Internet of Things (IoT) and artificial intelligence (AI). When it comes to product description and design requirements of the chip model, it is important to consider the actual use case and ensure that the design meets the needs of the user, taking into account the safety and reliability of the chip model as well as any potential risks. Case studies can also be used to better understand the application of the chip model and help users to make informed decisions about the design.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||