AMD Xilinx
XQV1000-4BG560N
XQV1000-4BG560N ECAD Model
XQV1000-4BG560N Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 404 | |
| Number of Outputs | 404 | |
| Number of Logic Cells | 27648 | |
| Number of Equivalent Gates | 1124022 | |
| Number of CLBs | 6144 | |
| Combinatorial Delay of a CLB-Max | 800 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | 38535Q/M;38534H;883B | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6144 CLBS, 1124022 GATES | |
| Power Supplies | 1.2/3.6,2.5 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.39.00.01 |
XQV1000-4BG560N Datasheet Download
XQV1000-4BG560N Overview
The XQV1000-4BG560N chip model is a powerful and reliable chip model designed for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL (Hardware Description Language) language, enabling users to quickly and accurately modify and debug their designs. This chip model is ideal for applications that require a high degree of precision and accuracy.
The XQV1000-4BG560N chip model has several advantages, including low power consumption, high speed, and a wide range of memory options. It is also highly reliable, making it suitable for mission-critical applications. In addition, the chip model is capable of supporting a variety of communication protocols, making it suitable for a wide range of applications.
The demand for the XQV1000-4BG560N chip model is expected to increase in the future, as the need for advanced digital signal processing, embedded processing, and image processing increases. With the development of the Internet of Things (IoT) and 5G networks, the demand for these chips will only increase. The chip model is expected to be used in a variety of applications, including smart home devices, connected cars, and industrial automation.
The XQV1000-4BG560N chip model is also expected to be used in the future in intelligent networks and intelligent scenarios. This chip model can be used to enable intelligent systems to interact with the environment in real-time. This chip model can be used to detect and respond to changes in the environment, allowing intelligent systems to make decisions in real-time. This chip model can also be used to enable intelligent systems to process large amounts of data quickly and accurately.
The XQV1000-4BG560N chip model is a powerful and reliable chip model that can be used in a variety of applications. It is expected to be used in the future in intelligent networks and intelligent scenarios, enabling intelligent systems to interact with the environment in real-time and process large amounts of data quickly and accurately. This chip model is ideal for mission-critical applications and is expected to be in high demand in the future.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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