AMD Xilinx
XQV100-4CB228M
XQV100-4CB228M ECAD Model
XQV100-4CB228M Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 162 | |
| Number of Outputs | 162 | |
| Number of Logic Cells | 2700 | |
| Number of Equivalent Gates | 108904 | |
| Number of CLBs | 600 | |
| Combinatorial Delay of a CLB-Max | 800 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | MIL-PRF-38535 | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 600 CLBS, 108904 GATES | |
| Power Supplies | 1.5/3.3,2.5 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-CQFP-F228 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Number of Terminals | 228 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | GQFF | |
| Package Equivalence Code | TPAK228,2.5SQ,25 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, GUARD RING | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | FLAT | |
| Terminal Pitch | 635 µm | |
| Terminal Position | QUAD | |
| Width | 39.37 mm | |
| Length | 39.37 mm | |
| Seated Height-Max | 3.302 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | CERAMIC, QFP-228 | |
| Pin Count | 228 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.39.00.01 |
XQV100-4CB228M Datasheet Download
XQV100-4CB228M Overview
The XQV100-4CB228M chip model has been gaining significant attention in recent years due to its advanced features and capabilities. It is a highly advanced chip model that has been designed to provide a wide range of applications to a variety of industries. This chip model offers a number of advantages, including its high processing power, low power consumption, and its capacity to support a wide range of applications.
The XQV100-4CB228M chip model is expected to be in high demand in the coming years, as the need for advanced technologies continues to grow. This chip model is expected to be used in a variety of industries, including automotive, medical, and industrial. It is also expected to be used in a number of networks and intelligent scenarios, such as the Internet of Things (IoT) and artificial intelligence (AI).
The XQV100-4CB228M chip model is expected to be used in the development and popularization of future intelligent robots. This chip model is capable of providing the necessary processing power and features to support the development of robots. However, the use of this chip model requires a certain level of technical expertise. It is important for users to have a good understanding of the chip model and its capabilities in order to effectively use it for the development of robots.
In conclusion, the XQV100-4CB228M chip model has a number of advantages that make it an attractive option for a variety of industries. It is expected to be in high demand in the coming years and will be used in a number of networks and intelligent scenarios. It is also expected to be used in the development and popularization of future intelligent robots. However, the use of this chip model requires a certain level of technical expertise in order to be used effectively.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||