AMD Xilinx
XQV100-4BG256N
XQV100-4BG256N ECAD Model
XQV100-4BG256N Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 180 | |
| Number of Outputs | 180 | |
| Number of Logic Cells | 2700 | |
| Number of Equivalent Gates | 108904 | |
| Number of CLBs | 600 | |
| Combinatorial Delay of a CLB-Max | 800 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | MIL-PRF-38535 | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 600 CLBS, 108904 GATES | |
| Power Supplies | 1.5/3.3,2.5 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,20X20,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.39.00.01 |
XQV100-4BG256N Datasheet Download
XQV100-4BG256N Overview
The chip model XQV100-4BG256N is a cutting-edge model that has been developed to meet the needs of modern industry. It is a four-layer model with 256 pins, and is designed to provide high performance and reliable operation in a variety of applications. The chip model XQV100-4BG256N is designed to handle all kinds of data processing, storage and communication tasks with reliable performance. It has been designed to be compatible with many of the latest technologies, including high-speed Ethernet, USB 3.0, and PCI Express.
The chip model XQV100-4BG256N offers several advantages that make it attractive to industry. It has a low power consumption, which is ideal for applications where power efficiency is a priority. It is also very reliable, with a long life expectancy and a high level of performance. Additionally, it is designed to be compatible with a wide range of operating systems, including Windows, Linux, and Mac OS X.
In terms of industry trends, the chip model XQV100-4BG256N is expected to be in high demand in the future. It is well suited for use in a variety of applications, including automotive, industrial, and medical. The chip model is also expected to be in demand in the gaming industry, as it is capable of handling the high performance requirements of modern games.
The product description of the chip model XQV100-4BG256N includes a number of specific design requirements. It is designed to be compatible with a wide range of operating systems, including Windows, Linux, and Mac OS X. It is also designed to be compatible with a variety of communication protocols, including Ethernet, USB 3.0, and PCI Express. Additionally, it is designed to be compatible with a variety of memory types, including DDR3 and DDR4.
In terms of actual case studies, the chip model XQV100-4BG256N has been used in a wide range of applications. It has been used in the automotive industry for autonomous vehicles, in the industrial sector for industrial automation, and in the medical industry for medical imaging. Additionally, it has been used in the gaming industry for high-performance gaming systems.
When considering whether the application environment requires the support of new technologies, it is important to consider the specific requirements of the application. If the application requires high performance, then the chip model XQV100-4BG256N is an ideal choice, as it is designed to handle high-performance tasks with reliable performance. Additionally, if the application requires compatibility with a variety of communication protocols or memory types, then the chip model XQV100-4BG256N is a good choice, as it is designed to be compatible with a variety of protocols and memory types.
Overall, the chip model XQV100-4BG256N is an ideal choice for a variety of applications. It offers a number of advantages, including low power consumption, reliable performance, and compatibility with a variety of operating systems and communication protocols. Additionally, it has been used in a variety of industries, including automotive, industrial, and medical. Therefore, it is a great choice for applications that require high performance or compatibility with a variety of technologies.
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