AMD Xilinx
XQR1701LCC44V
XQR1701LCC44V ECAD Model
XQR1701LCC44V Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Obsolete | |
| Memory Density | 1.0486 Mbit | |
| Memory Width | 1 | |
| Organization | 1MX1 | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Clock Frequency-Max (fCLK) | 15 MHz | |
| Memory IC Type | CONFIGURATION MEMORY | |
| Number of Functions | 1 | |
| Number of Words Code | 1000000 | |
| Number of Words | 1.0486 M | |
| Operating Mode | SYNCHRONOUS | |
| Parallel/Serial | SERIAL | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| JESD-30 Code | S-CQCC-J44 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Total Dose | 50k Rad(Si) V | |
| Number of Terminals | 44 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | QCCJ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Seated Height-Max | 4.826 mm | |
| Length | 16.51 mm | |
| Width | 16.51 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | LCC | |
| Package Description | QCCJ, | |
| Pin Count | 44 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.61 |
XQR1701LCC44V Datasheet Download
XQR1701LCC44V Overview
The XQR1701LCC44V chip model is a high-performance chip model that is suitable for digital signal processing, embedded processing, and image processing. It is designed to be used with HDL language, which is a programming language specifically used for digital design and hardware description. The chip model is well-suited for applications that require high-performance computing and digital signal processing capabilities.
The XQR1701LCC44V chip model offers many advantages, such as high performance, low power consumption, and small size. It also offers a wide range of features, such as on-chip memory, on-chip debugging, and an integrated DMA controller. These features make the chip model an ideal choice for applications that require high-performance computing.
In terms of future demand trends, the XQR1701LCC44V chip model is expected to be in high demand in the coming years. As the world moves towards an increasingly digital and connected world, the demand for high-performance computing capabilities will be on the rise. This chip model is well-suited for applications that require high-performance computing, such as image processing, embedded processing, and digital signal processing.
In terms of networks and intelligent scenarios, the XQR1701LCC44V chip model can be used in a variety of applications. It can be used in intelligent systems such as autonomous vehicles, robotics, and AI-driven systems. It can also be used in networks to enable high-speed data transfer, secure communication, and real-time data processing. In the era of fully intelligent systems, the XQR1701LCC44V chip model can be used to enable high-performance computing capabilities.
Overall, the XQR1701LCC44V chip model is a high-performance chip model that is suitable for digital signal processing, embedded processing, and image processing. It offers many advantages, such as high performance, low power consumption, and small size. In the future, the chip model is expected to be in high demand, as the world moves towards an increasingly digital and connected world. It can be used in a variety of applications, such as intelligent systems, networks, and real-time data processing. The XQR1701LCC44V chip model is an ideal choice for applications that require high-performance computing capabilities.
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|---|---|---|
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