XQ7Z045-1RFG676Q
XQ7Z045-1RFG676Q
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XQ7Z045-1RFG676Q


XQ7Z045-1RFG676Q
F20-XQ7Z045-1RFG676Q
Active
CMOS, BGA
BGA

XQ7Z045-1RFG676Q ECAD Model


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XQ7Z045-1RFG676Q Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Temperature Grade AUTOMOTIVE
JESD-30 Code S-PBGA-B676
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Seated Height-Max 3.37 mm
Width 27 mm
Length 27 mm
Ihs Manufacturer XILINX INC
Package Description BGA,
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XQ7Z045-1RFG676Q Datasheet Download


XQ7Z045-1RFG676Q Overview



The XQ7Z045-1RFG676Q chip model is a powerful and versatile chip that is suitable for a range of different applications. It is well-suited for high-performance digital signal processing, embedded processing, and image processing, requiring the use of HDL language. This chip model has the potential to be used in the development and popularization of future intelligent robots, requiring specific technical skills to use it effectively.


In terms of industry trends, the chip model XQ7Z045-1RFG676Q is part of the ever-evolving semiconductor industry, with new technologies and applications being developed all the time. Whether the application environment requires the support of new technologies depends on the specific technologies needed for the task. As the chip model is used for more and more applications, it is likely that new technologies will be needed to support them.


The chip model XQ7Z045-1RFG676Q is a powerful tool for the development and popularization of future intelligent robots. In order to use the model effectively, it is important to have the right technical skills. This includes knowledge of HDL language, as well as knowledge of the specific technologies needed for the task. Additionally, knowledge of the industry trends and the potential of new technologies is important in order to make the most of the chip model.


In conclusion, the chip model XQ7Z045-1RFG676Q is a powerful and versatile chip that is suitable for a range of different applications. It is well-suited for high-performance digital signal processing, embedded processing, and image processing, requiring the use of HDL language. In order to use the model effectively, it is important to have the right technical skills, as well as knowledge of the industry trends and the potential of new technologies. This chip model has the potential to be used in the development and popularization of future intelligent robots.



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