XQ7Z030-2RF676I
XQ7Z030-2RF676I
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rohs

AMD Xilinx

XQ7Z030-2RF676I


XQ7Z030-2RF676I
F20-XQ7Z030-2RF676I
Active
CMOS, FBGA-676
FBGA-676

XQ7Z030-2RF676I ECAD Model


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XQ7Z030-2RF676I Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Surface Mount YES
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Power Supplies 1,1.8 V
Temperature Grade INDUSTRIAL
UV Erasable N
JESD-30 Code S-PBGA-B676
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Seated Height-Max 3.37 mm
Width 27 mm
Length 27 mm
Ihs Manufacturer XILINX INC
Package Description FBGA-676
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XQ7Z030-2RF676I Datasheet Download


XQ7Z030-2RF676I Overview



The XQ7Z030-2RF676I chip model is a powerful solution for high-performance digital signal processing, embedded processing, and image processing applications. This model is designed for use with a hardware description language (HDL) and is capable of delivering impressive results.


The XQ7Z030-2RF676I chip model is built with a range of features that make it a great choice for many applications. It is equipped with a dual-core ARM Cortex-A53 processor that delivers high performance and low power consumption. It also features a dedicated image signal processor and a vector floating-point unit for advanced image processing. Additionally, it is equipped with 2MB of on-chip RAM and 4MB of on-chip flash memory.


The XQ7Z030-2RF676I chip model is also designed to be highly reliable, providing a robust and secure platform for digital signal processing, embedded processing, and image processing applications. It is designed with a range of safety features, including an advanced watchdog timer and a secure boot feature. Furthermore, the model is designed to be highly configurable, providing users with the flexibility to customize their applications according to their specific needs.


The XQ7Z030-2RF676I chip model is expected to be in high demand in the coming years due to its impressive performance and features. This model is ideal for applications that require high-performance digital signal processing, embedded processing, and image processing. It is also expected to be a great choice for applications that require a highly reliable and secure platform.


When designing with the XQ7Z030-2RF676I chip model, it is important to consider the specific design requirements of the application. For example, the specific clock frequency and power consumption requirements should be taken into account. Additionally, the specific memory requirements of the application should be taken into account. It is also important to consider any safety-critical requirements of the application, as the XQ7Z030-2RF676I model is designed with a range of safety features.


To demonstrate the capabilities of the XQ7Z030-2RF676I chip model, a number of case studies have been conducted. For example, the model has been used to successfully implement a motion-tracking system and an image-processing system. In both cases, the model was able to deliver impressive results.


When designing with the XQ7Z030-2RF676I chip model, it is important to take the necessary precautions. It is important to ensure that the model is used in a safe and secure environment, as it is designed with a range of safety features. Additionally, it is important to ensure that the model is used in accordance with the manufacturer’s instructions.


In conclusion, the XQ7Z030-2RF676I chip model is a powerful solution for high-performance digital signal processing, embedded processing, and image processing applications. This model is designed for use with a hardware description language (HDL) and is capable of delivering impressive results. It is expected to be in high demand in the coming years due to its impressive performance and features, and it is important to consider the specific design requirements of the application when designing with the model. Additionally, it is important to take the necessary precautions when using the model.



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