
AMD Xilinx
XQ7Z030-2RF676I
XQ7Z030-2RF676I ECAD Model
XQ7Z030-2RF676I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Power Supplies | 1,1.8 V | |
Temperature Grade | INDUSTRIAL | |
UV Erasable | N | |
JESD-30 Code | S-PBGA-B676 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 676 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA676,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Seated Height-Max | 3.37 mm | |
Width | 27 mm | |
Length | 27 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | FBGA-676 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XQ7Z030-2RF676I Datasheet Download
XQ7Z030-2RF676I Overview
The XQ7Z030-2RF676I chip model is a powerful solution for high-performance digital signal processing, embedded processing, and image processing applications. This model is designed for use with a hardware description language (HDL) and is capable of delivering impressive results.
The XQ7Z030-2RF676I chip model is built with a range of features that make it a great choice for many applications. It is equipped with a dual-core ARM Cortex-A53 processor that delivers high performance and low power consumption. It also features a dedicated image signal processor and a vector floating-point unit for advanced image processing. Additionally, it is equipped with 2MB of on-chip RAM and 4MB of on-chip flash memory.
The XQ7Z030-2RF676I chip model is also designed to be highly reliable, providing a robust and secure platform for digital signal processing, embedded processing, and image processing applications. It is designed with a range of safety features, including an advanced watchdog timer and a secure boot feature. Furthermore, the model is designed to be highly configurable, providing users with the flexibility to customize their applications according to their specific needs.
The XQ7Z030-2RF676I chip model is expected to be in high demand in the coming years due to its impressive performance and features. This model is ideal for applications that require high-performance digital signal processing, embedded processing, and image processing. It is also expected to be a great choice for applications that require a highly reliable and secure platform.
When designing with the XQ7Z030-2RF676I chip model, it is important to consider the specific design requirements of the application. For example, the specific clock frequency and power consumption requirements should be taken into account. Additionally, the specific memory requirements of the application should be taken into account. It is also important to consider any safety-critical requirements of the application, as the XQ7Z030-2RF676I model is designed with a range of safety features.
To demonstrate the capabilities of the XQ7Z030-2RF676I chip model, a number of case studies have been conducted. For example, the model has been used to successfully implement a motion-tracking system and an image-processing system. In both cases, the model was able to deliver impressive results.
When designing with the XQ7Z030-2RF676I chip model, it is important to take the necessary precautions. It is important to ensure that the model is used in a safe and secure environment, as it is designed with a range of safety features. Additionally, it is important to ensure that the model is used in accordance with the manufacturer’s instructions.
In conclusion, the XQ7Z030-2RF676I chip model is a powerful solution for high-performance digital signal processing, embedded processing, and image processing applications. This model is designed for use with a hardware description language (HDL) and is capable of delivering impressive results. It is expected to be in high demand in the coming years due to its impressive performance and features, and it is important to consider the specific design requirements of the application when designing with the model. Additionally, it is important to take the necessary precautions when using the model.
You May Also Be Interested In
1,415 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
No reference price found. |