XQ7VX330T-1RF1761M
XQ7VX330T-1RF1761M
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AMD Xilinx

XQ7VX330T-1RF1761M

XQ7VX330T-1RF1761M
AMD Xilinx
F20-XQ7VX330T-1RF1761M
Active
FIELD PROGRAMMABLE GATE ARRAY, HKMG, 42.50 X 42.50 MM, 1 MM PITCH, FBGA-1761
42.50 X 42.50 MM, 1 MM PITCH, FBGA-1761
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XQ7VX330T-1RF1761M Datasheet (PDF)
XQ7VX330T-1RF1761M Document (PDF)

XQ7VX330T-1RF1761M ECAD Model

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XQ7VX330T-1RF1761M Attributes

Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1 V
Number of Inputs 700
Number of Outputs 700
Number of Logic Cells 326400
Number of CLBs 25500
Combinatorial Delay of a CLB-Max 740 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade MILITARY
Package Shape SQUARE
Technology HKMG
Organization 25500 CLBS
Supply Voltage-Max 1.03 V
Supply Voltage-Min 970 mV
JESD-30 Code S-PBGA-B1761
JESD-609 Code e0
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1761
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 4.57 mm
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
Package Description 42.50 X 42.50 MM, 1 MM PITCH, FBGA-1761
ECCN Code 3A001.A.2.C

XQ7VX330T-1RF1761M Datasheet Download

XQ7VX330T-1RF1761M Overview


The chip model XQ7VX330T-1RF1761M is a powerful integrated circuit (IC) designed for use in advanced communication systems. It is a versatile solution that can be used in a wide range of applications, from consumer electronics to industrial automation. This chip model is capable of supporting a variety of communication protocols, including Ethernet, Wi-Fi, Bluetooth, and more. It also supports advanced features such as network security, error correction, and data rate optimization.


The original design intention of the XQ7VX330T-1RF1761M chip was to provide a reliable and powerful solution for advanced communication systems. It was designed to be a cost-effective solution that could be used in a wide range of applications. This chip model has been proven to be reliable and efficient in a variety of applications, and it is capable of supporting a variety of communication protocols. This makes it a great choice for any system that needs to be able to communicate over multiple networks.


As the industry continues to evolve, the XQ7VX330T-1RF1761M chip may need to be upgraded to keep up with the latest trends. This chip model is capable of supporting new technologies, such as 5G, and can be used in advanced communication systems. It is also capable of being used in the era of fully intelligent systems, allowing it to be used in networks and intelligent scenarios.


In conclusion, the XQ7VX330T-1RF1761M chip is a powerful and reliable integrated circuit that can be used in a wide range of applications. It is capable of supporting a variety of communication protocols, and it can be upgraded to keep up with the latest industry trends. Additionally, this chip model can be used in networks and intelligent scenarios, making it a great choice for any system that needs to be able to communicate over multiple networks.



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Parts Index

XQ7VX330T-1RF1761
2
XQ7VX330T-1RF
4
XQ7VX330T-1
4
XQ7VX330T-
8
XQ7VX330
8
XQ7VX
28
XQ7
118
XQ
1107