AMD Xilinx
XQ7VX330T-1RF1157M
XQ7VX330T-1RF1157M ECAD Model
XQ7VX330T-1RF1157M Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 600 | |
| Number of Outputs | 600 | |
| Number of Logic Cells | 326400 | |
| Number of CLBs | 25500 | |
| Combinatorial Delay of a CLB-Max | 740 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | HKMG | |
| Organization | 25500 CLBS | |
| Supply Voltage-Max | 1.03 V | |
| Supply Voltage-Min | 970 mV | |
| JESD-30 Code | S-PBGA-B1157 | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1157 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.48 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Package Description | 35 X 35 MM, 1 MM PITCH, FBGA-1157 | |
| ECCN Code | 3A001.A.2.C |
XQ7VX330T-1RF1157M Datasheet Download
XQ7VX330T-1RF1157M Overview
The XQ7VX330T-1RF1157M chip model is a powerful and advanced digital signal processor, embedded processor, and image processor. It is designed to be used with HDL language, which is the high-level programming language used for digital systems design, verification, and synthesis. This chip model is capable of providing high-performance digital signal processing, embedded processing, and image processing, making it suitable for a wide range of applications.
The XQ7VX330T-1RF1157M chip model has several advantages that make it an attractive option for many industries. It is highly efficient, as it can process data quickly and accurately. It is also highly reliable, as it is designed to withstand high temperatures and other environmental conditions. Additionally, it is cost-effective, as it requires fewer components than other similar models.
The expected demand for the XQ7VX330T-1RF1157M chip model is likely to increase in the future, as more industries are beginning to recognize its potential. It is likely to be used in a variety of applications, including automotive, industrial, and consumer electronics. It is also likely to be used in network-related applications, such as routers, switches, and modems. Furthermore, it is likely to be used in various intelligent scenarios, such as machine learning and artificial intelligence.
The XQ7VX330T-1RF1157M chip model is also likely to be used in the era of fully intelligent systems. It is likely to be used in a variety of applications, such as autonomous vehicles, robotics, and smart homes. It is also likely to be used in the development of new technologies, such as 5G networks and the Internet of Things. As these technologies continue to develop, the XQ7VX330T-1RF1157M chip model will become increasingly important.
In conclusion, the XQ7VX330T-1RF1157M chip model is a powerful and advanced digital signal processor, embedded processor, and image processor. It has several advantages that make it an attractive option for many industries, and the demand for this model is likely to increase in the future. It is likely to be used in various applications and intelligent scenarios, including autonomous vehicles, robotics, and smart homes. Additionally, it is likely to be used in the development of new technologies, such as 5G networks and the Internet of Things.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||