
AMD Xilinx
XQ7V585T-L2RF1761E
XQ7V585T-L2RF1761E ECAD Model
XQ7V585T-L2RF1761E Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 600 | |
Number of Outputs | 600 | |
Number of Logic Cells | 582720 | |
Number of CLBs | 45525 | |
Combinatorial Delay of a CLB-Max | 610 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | HKMG | |
Organization | 45525 CLBS | |
Supply Voltage-Max | 1.03 V | |
Supply Voltage-Min | 970 mV | |
JESD-30 Code | S-PBGA-B1761 | |
JESD-609 Code | e0 | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1761 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 4.57 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | 42.50 X 42.50 MM, 1 MM PITCH, FBGA-1761 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.7.A | |
HTS Code | 8542.39.00.01 |
XQ7V585T-L2RF1761E Datasheet Download
XQ7V585T-L2RF1761E Overview
The XQ7V585T-L2RF1761E chip model is a powerful tool for digital signal processing, embedded processing, and image processing. It requires the use of HDL language, a hardware description language, to program it. With its high performance and versatile capabilities, it is quickly becoming an industry standard for these types of applications.
The future of the XQ7V585T-L2RF1761E chip model is dependent on the specific technologies needed for the application environment. As technology advances, new technologies may be required to keep up with industry trends. In addition, the chip model may be applied to networks and intelligent scenarios. With the rise of the Internet of Things and artificial intelligence, the chip model could be used in the era of fully intelligent systems.
The XQ7V585T-L2RF1761E chip model is a versatile tool that can be used in a variety of applications. With its high performance and ability to be programmed with HDL language, it is quickly becoming an industry standard for digital signal processing, embedded processing, and image processing. As technology advances, the chip model could be applied to networks and intelligent scenarios, making it a valuable tool in the era of fully intelligent systems. With its powerful capabilities, the XQ7V585T-L2RF1761E chip model is a great choice for those looking for a versatile and powerful solution for their application needs.
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Pricing (USD)
QTY | Unit Price | Ext Price |
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