XQ7V585T-L2RF1761E
XQ7V585T-L2RF1761E
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XQ7V585T-L2RF1761E


XQ7V585T-L2RF1761E
F20-XQ7V585T-L2RF1761E
Active
FIELD PROGRAMMABLE GATE ARRAY, HKMG, 42.50 X 42.50 MM, 1 MM PITCH, FBGA-1761
42.50 X 42.50 MM, 1 MM PITCH, FBGA-1761

XQ7V585T-L2RF1761E ECAD Model


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XQ7V585T-L2RF1761E Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1 V
Number of Inputs 600
Number of Outputs 600
Number of Logic Cells 582720
Number of CLBs 45525
Combinatorial Delay of a CLB-Max 610 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology HKMG
Organization 45525 CLBS
Supply Voltage-Max 1.03 V
Supply Voltage-Min 970 mV
JESD-30 Code S-PBGA-B1761
JESD-609 Code e0
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1761
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 4.57 mm
Ihs Manufacturer XILINX INC
Package Description 42.50 X 42.50 MM, 1 MM PITCH, FBGA-1761
Reach Compliance Code not_compliant
ECCN Code 3A001.A.7.A
HTS Code 8542.39.00.01

XQ7V585T-L2RF1761E Datasheet Download


XQ7V585T-L2RF1761E Overview



The XQ7V585T-L2RF1761E chip model is a powerful tool for digital signal processing, embedded processing, and image processing. It requires the use of HDL language, a hardware description language, to program it. With its high performance and versatile capabilities, it is quickly becoming an industry standard for these types of applications.


The future of the XQ7V585T-L2RF1761E chip model is dependent on the specific technologies needed for the application environment. As technology advances, new technologies may be required to keep up with industry trends. In addition, the chip model may be applied to networks and intelligent scenarios. With the rise of the Internet of Things and artificial intelligence, the chip model could be used in the era of fully intelligent systems.


The XQ7V585T-L2RF1761E chip model is a versatile tool that can be used in a variety of applications. With its high performance and ability to be programmed with HDL language, it is quickly becoming an industry standard for digital signal processing, embedded processing, and image processing. As technology advances, the chip model could be applied to networks and intelligent scenarios, making it a valuable tool in the era of fully intelligent systems. With its powerful capabilities, the XQ7V585T-L2RF1761E chip model is a great choice for those looking for a versatile and powerful solution for their application needs.



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