AMD Xilinx
XQ6VSX315T-1FFG1156I
XQ6VSX315T-1FFG1156I ECAD Model
XQ6VSX315T-1FFG1156I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 600 | |
| Number of Outputs | 600 | |
| Number of Logic Cells | 315000 | |
| Number of CLBs | 24600 | |
| Combinatorial Delay of a CLB-Max | 790 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 24600 CLBS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1156 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1156,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.53 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D | |
| Package Description | 35 X 35 MM, LEAD FREE, FBGA-1156 |
XQ6VSX315T-1FFG1156I Datasheet Download
XQ6VSX315T-1FFG1156I Overview
The chip model XQ6VSX315T-1FFG1156I is a high-performance device designed for digital signal processing, embedded processing, image processing and other applications. It is based on the Xilinx Virtex-6 FPGA family and is programmed using the HDL language. The model is designed to be highly flexible and can be used in a wide variety of applications, including advanced communication systems.
The original design intention of the chip model XQ6VSX315T-1FFG1156I was to provide a powerful and efficient platform for digital signal processing and embedded processing applications. It is designed to be highly scalable and can be easily upgraded for future applications. It is also capable of running complex algorithms and implementing sophisticated algorithms.
The chip model XQ6VSX315T-1FFG1156I can also be used in the development and popularization of future intelligent robots. It can be used to create intelligent robots that can interact with their environment and make decisions based on the data they receive. The model is also capable of running complex algorithms and implementing sophisticated algorithms. To use the model effectively, technical talents such as software engineers, electrical engineers, and computer scientists are needed.
In conclusion, the chip model XQ6VSX315T-1FFG1156I is a powerful and versatile device that can be used in a variety of applications. It is designed to be highly scalable and can be easily upgraded for future applications. It can also be used in the development and popularization of future intelligent robots. To use the model effectively, technical talents such as software engineers, electrical engineers, and computer scientists are needed.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||