XQ6VLX240T-L1FFG1156I
XQ6VLX240T-L1FFG1156I
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rohs

AMD Xilinx

XQ6VLX240T-L1FFG1156I


XQ6VLX240T-L1FFG1156I
F20-XQ6VLX240T-L1FFG1156I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS
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XQ6VLX240T-L1FFG1156I ECAD Model


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XQ6VLX240T-L1FFG1156I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 900 mV
Number of Inputs 600
Number of Outputs 600
Number of Logic Cells 241000
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.098 GHz
Power Supplies 900 mV
JESD-30 Code S-PBGA-B1156
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 4
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1156
Package Body Material PLASTIC
Package Code BGA
Package Equivalence Code BGA1156,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XQ6VLX240T-L1FFG1156I Datasheet Download


XQ6VLX240T-L1FFG1156I Overview



The XQ6VLX240T-L1FFG1156I chip model is a highly advanced, reliable and robust system-on-chip (SoC) solution for embedded systems. It is designed to meet the stringent requirements of the most demanding applications, including industrial automation, medical, automotive and aerospace. The XQ6VLX240T-L1FFG1156I chip model is capable of processing data at high speeds and with low power consumption, making it an ideal choice for embedded systems.


The XQ6VLX240T-L1FFG1156I chip model has a number of advantages over other chip models. It features an ARM Cortex-A9 processor core, which is capable of running multiple operating systems simultaneously. It also includes a large selection of peripherals, such as Ethernet, UART, I2C, SPI, and USB, as well as a wide range of memory options. In addition, the XQ6VLX240T-L1FFG1156I chip model has a powerful FPGA fabric and a wide range of I/O options, making it suitable for a variety of applications.


The XQ6VLX240T-L1FFG1156I chip model is expected to be in high demand in the near future, due to its high performance and low power consumption. It is also expected to be used in a variety of applications, such as industrial automation, medical, automotive and aerospace. It is also expected to be used in advanced communication systems, such as 5G cellular networks and Wi-Fi 6.


The XQ6VLX240T-L1FFG1156I chip model is designed to meet the specific requirements of the various applications it is intended for. It has a wide range of features and options that can be tailored to the specific needs of the application. It also has a number of safety features, such as ESD protection and advanced error correction, to ensure reliable operation.


In addition, the XQ6VLX240T-L1FFG1156I chip model is designed to be upgradable and expandable, allowing for future growth. It is also designed to be compatible with a number of different operating systems, allowing for flexibility in the future.


The XQ6VLX240T-L1FFG1156I chip model has been used in a number of different applications, including industrial automation, medical, automotive and aerospace. In each case, the chip model has been shown to provide reliable and robust performance. In addition, the chip model has been designed with a number of safety features, such as ESD protection and advanced error correction, to ensure reliable operation.


When using the XQ6VLX240T-L1FFG1156I chip model, it is important to consider the specific requirements of the application. It is also important to ensure that the chip model is compatible with the operating system and other components of the system. In addition, it is important to consider the safety features of the chip model, such as ESD protection and advanced error correction, to ensure reliable operation.


Overall, the XQ6VLX240T-L1FFG1156I chip model is a highly advanced and reliable system-on-chip solution for embedded systems. It is designed to meet the stringent requirements of the most demanding applications, and is expected to be in high demand in the near future. It is also designed to be upgradable and expandable, allowing for future growth, and is compatible with a number of different operating systems. In addition, it has a number of safety features, such as ESD protection and advanced error correction, to ensure reliable operation.



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