XQ6VLX130T-L1RF1156I
XQ6VLX130T-L1RF1156I
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rohs

AMD Xilinx

XQ6VLX130T-L1RF1156I


XQ6VLX130T-L1RF1156I
F20-XQ6VLX130T-L1RF1156I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS
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XQ6VLX130T-L1RF1156I ECAD Model


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XQ6VLX130T-L1RF1156I Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 600
Number of Outputs 600
Number of Logic Cells 128000
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.098 GHz
Power Supplies 900 mV
JESD-30 Code S-PBGA-B1156
Qualification Status Not Qualified
JESD-609 Code e0
Number of Terminals 1156
Package Body Material PLASTIC
Package Code BGA
Package Equivalence Code BGA1156,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
ECCN Code 3A991.D

XQ6VLX130T-L1RF1156I Datasheet Download


XQ6VLX130T-L1RF1156I Overview



The XQ6VLX130T-L1RF1156I chip model is a new and advanced technology from Xilinx. It is the latest in a series of FPGA products that offer high performance and reliability. The model is designed for use in a wide range of industries, including automotive, aerospace, communications, medical, and industrial applications.


The XQ6VLX130T-L1RF1156I chip model features a Virtex-6 FPGA family with an integrated PowerPC processor. It is a reliable and powerful solution that can meet the needs of many industries. The model is designed to provide high performance and low power consumption, along with a high level of flexibility and scalability.


The XQ6VLX130T-L1RF1156I chip model has a number of advantages, including a high-speed, low-power, and low-cost solution. It is also designed to be highly reliable and secure, with a wide range of features and functions. The model is also designed to be easily upgradable, allowing users to upgrade their systems with the latest features and technologies.


The demand for the XQ6VLX130T-L1RF1156I chip model is expected to continue to increase in the future. This is due to its high performance, reliability, and scalability, as well as its ability to be easily upgraded. The model is also expected to be used in a wide range of industries, including automotive, aerospace, communications, medical, and industrial applications.


The XQ6VLX130T-L1RF1156I chip model is designed to meet specific design requirements. It is designed to provide a high level of performance and reliability, while also being low-cost and low-power. The model is also designed to be easily upgradable, allowing users to upgrade their systems with the latest features and technologies.


The XQ6VLX130T-L1RF1156I chip model has been used in a number of applications, including automotive, aerospace, communications, medical, and industrial applications. The model has been tested in a variety of environments and has been proven to be reliable and secure. In addition, the model has been used in a number of case studies, providing a clear indication of its capabilities and potential.


When using the XQ6VLX130T-L1RF1156I chip model, it is important to take certain precautions. It is important to ensure that the model is properly installed and configured, and that it is regularly maintained and updated. It is also important to ensure that the model is used in accordance with its design specifications and that it is not used in any application that could potentially cause harm to the system or its users.



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