AMD Xilinx
XQ6VLX130T-1FFG1156I
XQ6VLX130T-1FFG1156I ECAD Model
XQ6VLX130T-1FFG1156I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 600 | |
| Number of Outputs | 600 | |
| Number of Logic Cells | 128000 | |
| Number of CLBs | 10000 | |
| Combinatorial Delay of a CLB-Max | 790 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 10000 CLBS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1156 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1156,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.53 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Package Description | 35 X 35 MM, LEAD FREE, FBGA-1156 |
XQ6VLX130T-1FFG1156I Datasheet Download
XQ6VLX130T-1FFG1156I Overview
The XQ6VLX130T-1FFG1156I chip model is a powerful and versatile programmable logic device (PLD) with a wide range of applications. Developed by the semiconductor manufacturer Xilinx, it is a field programmable gate array (FPGA) which can be used to design digital circuits. The original design intention of the chip was to provide a flexible platform for the development of complex digital systems, and it can be used in a variety of applications ranging from embedded systems to advanced communication systems.
The XQ6VLX130T-1FFG1156I chip model is a highly versatile and configurable device, and its potential for future upgrades is limitless. It can be used to develop and deploy advanced network solutions, allowing for the implementation of intelligent scenarios and applications. With its wide range of features, the chip can be used to develop and optimize existing communication systems, as well as create new ones. Additionally, the chip can be used to develop and popularize future intelligent robots, as it is capable of providing the necessary data processing and control functions to support the development of these robots.
In order to use the XQ6VLX130T-1FFG1156I chip model effectively, knowledge of digital circuit design, programming and embedded systems is essential. Additionally, expertise in FPGA programming and embedded system design is also beneficial. With the right knowledge and skills, the chip model can be used to its full potential, allowing for the development of advanced communication systems and intelligent robots.
In conclusion, the XQ6VLX130T-1FFG1156I chip model is a powerful and versatile device which can be used for a wide range of applications. It can be used to develop and optimize existing communication systems, as well as create new ones. Additionally, the chip can be used to develop and popularize future intelligent robots. With the right knowledge and skills, the chip model can be used to its full potential, allowing for the development of advanced communication systems and intelligent robots.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||