AMD Xilinx
XQ6SLX75T-3FG676I
XQ6SLX75T-3FG676I ECAD Model
XQ6SLX75T-3FG676I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Number of Inputs | 348 | |
| Number of Outputs | 348 | |
| Number of Logic Cells | 74637 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 862 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5/3.3 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XQ6SLX75T-3FG676I Datasheet Download
XQ6SLX75T-3FG676I Overview
The XQ6SLX75T-3FG676I chip model is a powerful and versatile tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL (Hardware Description Language) programming language, allowing for the development of complex systems and applications. As such, it is becoming increasingly popular in a variety of industries, from automotive and aerospace to consumer electronics and medical devices.
The XQ6SLX75T-3FG676I chip model is well-suited for use in the rapidly-growing Internet of Things (IoT) and Artificial Intelligence (AI) markets. Its ability to process digital signals quickly and accurately makes it ideal for use in smart homes and connected vehicles, as well as for applications in robotics, facial recognition, and more. It can also be used in networks, allowing for the development of intelligent systems and applications.
The XQ6SLX75T-3FG676I chip model is also well-suited for use in the emerging era of fully intelligent systems. As AI and machine learning continue to evolve, the XQ6SLX75T-3FG676I chip model provides a powerful platform for the development of sophisticated systems and applications. Its ability to process digital signals quickly and accurately makes it ideal for use in a wide range of intelligent scenarios, from autonomous vehicles and drones to intelligent surveillance systems.
The XQ6SLX75T-3FG676I chip model is an ideal choice for those looking to develop high-performance digital signal processing, embedded processing, and image processing applications. Its ability to process digital signals quickly and accurately, combined with its support for the HDL programming language, makes it an ideal choice for those looking to develop sophisticated systems and applications for the IoT and AI markets. As AI and machine learning continue to evolve, the XQ6SLX75T-3FG676I chip model provides a powerful platform for the development of sophisticated systems and applications for the emerging era of fully intelligent systems.
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5,070 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||