AMD Xilinx
XQ6SLX75T-3FG484I
XQ6SLX75T-3FG484I ECAD Model
XQ6SLX75T-3FG484I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Number of Inputs | 268 | |
| Number of Outputs | 268 | |
| Number of Logic Cells | 74637 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 862 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5/3.3 V | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XQ6SLX75T-3FG484I Datasheet Download
XQ6SLX75T-3FG484I Overview
The XQ6SLX75T-3FG484I chip model is a powerful and efficient solution for many industries. This model has several advantages that make it an attractive choice for a variety of applications. It is a low-power, high-performance, and cost-effective solution that can handle a wide range of tasks. Its low power consumption allows it to be used in energy-efficient applications, while its high performance makes it suitable for more demanding tasks.
The expected demand for the XQ6SLX75T-3FG484I chip model is likely to increase in the future. This is due to the rising demand for more efficient and cost-effective solutions for various applications. As technology continues to improve, the need for more powerful chips will also increase. This chip model is well-suited to meet this need, as it can handle a wide range of tasks with its low power consumption and high performance.
The XQ6SLX75T-3FG484I chip model can be applied to networks and intelligent scenarios in the future. It can be used to power a variety of devices, including sensors, cameras, and other connected devices. It can also be used to power intelligent systems, such as those used in autonomous vehicles and robotics. This chip model is also capable of handling more complex tasks, such as image and voice recognition.
The XQ6SLX75T-3FG484I chip model can also be applied to the development and popularization of future intelligent robots. This chip model is powerful enough to handle the complex tasks required of robots, such as navigation and object recognition. It is also efficient enough to be used in energy-efficient robots. To use the XQ6SLX75T-3FG484I chip model effectively, technical talents such as software engineers, hardware engineers, and AI experts are needed.
In conclusion, the XQ6SLX75T-3FG484I chip model is a powerful and efficient solution for many industries. It has several advantages that make it an attractive choice for a variety of applications. The expected demand for this chip model is likely to increase in the future, as technology continues to improve and the need for more powerful chips rises. This chip model can be applied to networks, intelligent scenarios, and the development and popularization of future intelligent robots. To use the XQ6SLX75T-3FG484I chip model effectively, technical talents such as software engineers, hardware engineers, and AI experts are needed.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||