
AMD Xilinx
XQ6SLX75T-3CSG484I
XQ6SLX75T-3CSG484I ECAD Model
XQ6SLX75T-3CSG484I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Number of Inputs | 292 | |
Number of Outputs | 292 | |
Number of Logic Cells | 74637 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Clock Frequency-Max | 862 MHz | |
Power Supplies | 1.2,1.2/3.3,2.5/3.3 V | |
JESD-30 Code | S-PBGA-B484 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 484 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Equivalence Code | BGA484,22X22,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 800 µm | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991.D |
XQ6SLX75T-3CSG484I Datasheet Download
XQ6SLX75T-3CSG484I Overview
The XQ6SLX75T-3CSG484I chip model is a high-performance device designed for digital signal processing, embedded processing, and image processing. It is a powerful tool for those who require the use of HDL language, which is a standard for hardware description language. The chip model was designed with the intention of providing users with a reliable and efficient system for their projects.
The XQ6SLX75T-3CSG484I chip model can be upgraded in the future to provide more features and capabilities as technology advances. It can also be applied to advanced communication systems, such as those used in the Internet of Things (IoT) and 5G networks. With its high-performance architecture, the chip can be used to develop and popularize future intelligent robots, which will require a deep understanding of the HDL language and the chip's architecture.
In order to use the XQ6SLX75T-3CSG484I chip model effectively, technical talents such as embedded software engineers and hardware engineers are needed. They should have a deep understanding of the HDL language and the chip's architecture. Additionally, they should be familiar with digital signal processing, embedded processing, and image processing. With the right technical personnel, the XQ6SLX75T-3CSG484I chip model can be used to create powerful and efficient systems for various applications.
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Pricing (USD)
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