AMD Xilinx
XQ6SLX75T-2FG676I
XQ6SLX75T-2FG676I ECAD Model
XQ6SLX75T-2FG676I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Number of Inputs | 348 | |
| Number of Outputs | 348 | |
| Number of Logic Cells | 74637 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 667 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5/3.3 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XQ6SLX75T-2FG676I Datasheet Download
XQ6SLX75T-2FG676I Overview
The XQ6SLX75T-2FG676I chip model is a cutting-edge technology that has been developed to meet the ever-growing demand for advanced computing and communication systems. The model is designed to provide a high-performance, cost-effective solution for businesses and organizations that require a reliable, powerful and efficient computing platform.
The XQ6SLX75T-2FG676I chip model offers a number of advantages over its predecessors, such as improved performance, lower power consumption, and increased flexibility. With its advanced features, the model is capable of handling complex tasks and providing a reliable and secure platform for the development and deployment of applications.
The model is also designed to be future-proof, with the possibility of future upgrades and the ability to be applied to advanced communication systems. This makes it an ideal choice for businesses and organizations that need a reliable and powerful computing platform that can keep up with the latest trends in technology.
The XQ6SLX75T-2FG676I chip model is also suitable for the development and popularization of future intelligent robots. Its advanced features make it capable of handling complex tasks and providing a reliable and secure platform for the development and deployment of applications. To use the model effectively, however, technical talents with a good understanding of the model's features and capabilities are needed.
Overall, the XQ6SLX75T-2FG676I chip model is a powerful and reliable computing platform that is designed to meet the ever-growing demand for advanced computing and communication systems. With its advanced features, the model is capable of handling complex tasks and providing a reliable and secure platform for the development and deployment of applications. It is also suitable for the development and popularization of future intelligent robots, although technical talents are needed to use the model effectively. As such, the model is expected to be in high demand in the coming years.
5,262 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||