XQ6SLX75-2CS484I
XQ6SLX75-2CS484I
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rohs

AMD Xilinx

XQ6SLX75-2CS484I


XQ6SLX75-2CS484I
F20-XQ6SLX75-2CS484I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS
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XQ6SLX75-2CS484I ECAD Model


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XQ6SLX75-2CS484I Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Number of Inputs 328
Number of Outputs 328
Number of Logic Cells 74637
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 667 MHz
Power Supplies 1.2,1.2/3.3,2.5/3.3 V
JESD-30 Code S-PBGA-B484
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 484
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA484,22X22,32
Package Shape SQUARE
Package Style GRID ARRAY, FINE PITCH
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 800 µm
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XQ6SLX75-2CS484I Datasheet Download


XQ6SLX75-2CS484I Overview



The XQ6SLX75-2CS484I chip model is a high-performance and cost-effective solution for a variety of applications. It is designed to meet the needs of both industrial and consumer markets, and is a great choice for a wide range of products. The chip model is based on the Xilinx Spartan-6 FPGA family and provides a low-power, low-cost, and high-performance solution.


The XQ6SLX75-2CS484I is an ideal choice for applications that require high-speed data transfer, high-performance processing, and flexible design options. It is designed to provide a reliable and cost-effective solution for a variety of applications, including consumer electronics, automotive, industrial, and medical. The chip model is equipped with the latest version of the Xilinx Spartan-6 FPGA family, allowing for enhanced performance and scalability.


The XQ6SLX75-2CS484I is a great choice for applications that require high-speed data transfer and processing. It is capable of providing up to 600 Mbps of data transfer rate, allowing for faster data transfer and more efficient processing. This chip model is also ideal for applications that require high-performance processing, such as machine learning, artificial intelligence, and data analytics.


The XQ6SLX75-2CS484I is expected to be in high demand in the future due to its high performance and cost-effective solution. This chip model is expected to be widely used in a variety of industries, from consumer electronics to automotive, industrial, and medical. The chip model is also expected to be used in the era of fully intelligent systems, as it is capable of providing high-speed data transfer and processing capabilities.


The XQ6SLX75-2CS484I is designed to meet the specific requirements of the customer. It is designed to provide a reliable and cost-effective solution for a variety of applications, and is capable of providing a high-speed data transfer rate, high-performance processing, and flexible design options. The chip model is also designed for applications that require low-power and low-cost solutions.


The XQ6SLX75-2CS484I is a great choice for a variety of applications, and is capable of providing a reliable and cost-effective solution. There are a number of case studies that demonstrate the effectiveness of the chip model in various applications, such as machine learning, artificial intelligence, and data analytics. It is also important to note that the chip model should be used with caution, as it can be susceptible to errors and malfunctions.



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