AMD Xilinx
XQ6SLX150T-3FG676I
XQ6SLX150T-3FG676I ECAD Model
XQ6SLX150T-3FG676I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Number of Inputs | 396 | |
| Number of Outputs | 396 | |
| Number of Logic Cells | 147443 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 862 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5/3.3 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XQ6SLX150T-3FG676I Datasheet Download
XQ6SLX150T-3FG676I Overview
The chip model XQ6SLX150T-3FG676I is a high-performance, low-power FPGA that is suitable for a range of applications, including digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which is a hardware description language used to program FPGAs.
The XQ6SLX150T-3FG676I chip has the potential to be used in a wide range of applications and intelligent scenarios in the future. It can be used in networks, such as for data processing, storage, and transmission. It can also be used in intelligent systems, such as for machine learning, artificial intelligence, and natural language processing. In addition, it can be used in autonomous systems, such as for self-driving cars, robots, and drones.
The product description of the XQ6SLX150T-3FG676I chip includes the following features: it is a low-power, high-performance FPGA with a 676-pin package; it has a wide range of configurable logic blocks, memory blocks, and digital signal processing blocks; it has a high-speed transceiver for communication; it has a built-in clock management system; and it has a variety of I/O options.
When designing with the XQ6SLX150T-3FG676I chip, there are several important considerations. The design should be optimized for low power consumption, as this will help to maximize the performance of the chip. In addition, the design should be tested thoroughly to ensure that it meets the desired specifications. Finally, the design should be modularized to make it easier to maintain and debug.
In conclusion, the XQ6SLX150T-3FG676I chip is a versatile and powerful FPGA that can be used in a wide range of applications and intelligent scenarios. It has a wide range of features and configurable options, and is designed to be used with the HDL language. When designing with the XQ6SLX150T-3FG676I chip, it is important to consider power consumption, testing, and modularization.
3,008 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||