XQ6SLX150-L1FG484I
XQ6SLX150-L1FG484I
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rohs

AMD Xilinx

XQ6SLX150-L1FG484I


XQ6SLX150-L1FG484I
F20-XQ6SLX150-L1FG484I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS
-

XQ6SLX150-L1FG484I ECAD Model


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XQ6SLX150-L1FG484I Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Number of Inputs 338
Number of Outputs 338
Number of Logic Cells 147443
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 500 MHz
Power Supplies 1,1.2/3.3,2.5/3.3 V
JESD-30 Code S-PBGA-B484
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 484
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA484,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
ECCN Code 3A991.D

XQ6SLX150-L1FG484I Datasheet Download


XQ6SLX150-L1FG484I Overview



The XQ6SLX150-L1FG484I chip model is a powerful, highly efficient, and reliable integrated circuit (IC) developed by Intel. This chip model is designed to meet the needs of various applications in the industrial, automotive, and consumer markets. It has a wide range of features and capabilities, making it an ideal choice for many applications.


The XQ6SLX150-L1FG484I chip model is designed to be highly efficient and reliable. It has a low power consumption and a high-performance architecture that allows it to process data quickly and accurately. The chip model also features a wide range of features, including a wide range of I/O capabilities, advanced memory protection, and a high-speed serial interface. It also offers a wide range of safety features, including a secure boot process, secure erase, and secure boot.


The XQ6SLX150-L1FG484I chip model is designed to meet the needs of various applications in the industrial, automotive, and consumer markets. It is suitable for a wide range of applications, including advanced communications systems, industrial automation systems, automotive infotainment systems, and consumer electronics. It can also be used in a wide range of applications, including medical devices, consumer electronics, and embedded systems.


The XQ6SLX150-L1FG484I chip model is designed to provide a high level of performance, reliability, and efficiency. It is designed to be highly adaptable, allowing it to be used in a wide range of applications. It has a wide range of features, including a wide range of I/O capabilities, advanced memory protection, and a high-speed serial interface. It also offers a wide range of safety features, including a secure boot process, secure erase, and secure boot.


The XQ6SLX150-L1FG484I chip model is designed to meet the needs of various applications in the industrial, automotive, and consumer markets. The chip model has a wide range of features and capabilities, making it an ideal choice for many applications. It is expected that demand for this chip model will continue to grow in these markets in the future.


The original design intention of the XQ6SLX150-L1FG484I chip model was to provide a high level of performance, reliability, and efficiency. The chip model was designed with a wide range of features and capabilities, making it an ideal choice for many applications. It is possible that the chip model will be upgraded in the future to meet the needs of new applications and technologies.


The product description and specific design requirements of the XQ6SLX150-L1FG484I chip model are outlined in the product datasheet. The datasheet outlines the features and capabilities of the chip model, as well as the design requirements for its use. The datasheet also provides a list of actual case studies and precautions for the use of the chip model.


In conclusion, the XQ6SLX150-L1FG484I chip model is a powerful, highly efficient, and reliable integrated circuit (IC) developed by Intel. It is designed to meet the needs of various applications in the industrial, automotive, and consumer markets. It has a wide range of features and capabilities, making it an ideal choice for many applications. It is expected that demand for this chip model will continue to grow in these markets in the future. The product description and specific design requirements of the chip model are outlined in the product datasheet, and actual case studies and precautions are also provided. It is possible that the chip model will be upgraded in the future to meet the needs of new applications and technologies.



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