AMD Xilinx
XQ5VLX110-2EF676I
XQ5VLX110-2EF676I ECAD Model
XQ5VLX110-2EF676I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 440 | |
| Number of Outputs | 440 | |
| Number of Logic Cells | 110592 | |
| Number of CLBs | 8640 | |
| Combinatorial Delay of a CLB-Max | 770 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.265 GHz | |
| Power Supplies | 1,2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 3 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FCBGA-676 | |
| Pin Count | 676 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XQ5VLX110-2EF676I Datasheet Download
XQ5VLX110-2EF676I Overview
The chip model XQ5VLX110-2EF676I is a high-performance, low-power field-programmable gate array (FPGA) designed by Xilinx. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. It is a great choice for applications that require high performance and low power consumption.
The chip model XQ5VLX110-2EF676I is a versatile and powerful chip, and it can be used for various applications. It is designed to meet the demands of high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. It is capable of handling complex tasks with ease and efficiency.
The chip model XQ5VLX110-2EF676I is an excellent choice for applications that require high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. It is highly reliable and can be used in a wide range of applications.
The industry trends of the chip model XQ5VLX110-2EF676I and the future development of related industries depends on what specific technologies are needed. As technology advances, the chip model XQ5VLX110-2EF676I will become more powerful and efficient. It is possible that new technologies may be needed to support the application environment.
The original design intention of the chip model XQ5VLX110-2EF676I was to provide a powerful and efficient solution for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. The chip model XQ5VLX110-2EF676I is highly reliable and can be used in a wide range of applications. It is also possible to upgrade the chip model XQ5VLX110-2EF676I in the future to make it even more powerful and efficient.
The chip model XQ5VLX110-2EF676I can be applied to advanced communication systems. It is highly reliable and can handle complex tasks with ease and efficiency. It is also possible to upgrade the chip model XQ5VLX110-2EF676I in the future to make it even more powerful and efficient. With the advancement of technology, it is possible that new technologies may be needed to support the application environment.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||