AMD Xilinx
XQ5VFX130T-2EF1738I
XQ5VFX130T-2EF1738I ECAD Model
XQ5VFX130T-2EF1738I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 840 | |
| Number of Outputs | 840 | |
| Number of Logic Cells | 131072 | |
| Number of CLBs | 11200 | |
| Combinatorial Delay of a CLB-Max | 770 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.265 GHz | |
| Power Supplies | 1,2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1738 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 1738 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1738,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FCBGA-1738 | |
| Pin Count | 1738 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.A | |
| HTS Code | 8542.39.00.01 |
XQ5VFX130T-2EF1738I Datasheet Download
XQ5VFX130T-2EF1738I Overview
The XQ5VFX130T-2EF1738I chip model is designed for high-performance digital signal processing, embedded processing, and image processing. It is programmed using HDL language, which provides a powerful and efficient platform for developing complex, high-performance applications. The chip model is designed to be highly efficient and reliable, making it an ideal choice for a variety of applications.
The XQ5VFX130T-2EF1738I chip model has several advantages that make it an attractive choice for industries that require high-performance processing and reliable operation. It has a low power consumption and high processing speed, making it suitable for applications that require high-performance processing, such as image processing and embedded processing. Additionally, the chip model is designed to be highly reliable, providing a high degree of reliability.
The demand for XQ5VFX130T-2EF1738I chip models is likely to increase in the future as more industries become aware of its advantages. Industries such as automotive, aerospace, and medical are likely to see an increased demand for the model as they require high-performance processing and reliable operation. Additionally, the chip model is likely to be used in networks and intelligent scenarios, such as artificial intelligence and machine learning.
The chip model is also likely to be used in the era of fully intelligent systems. Its low power consumption and high processing speed make it an ideal choice for applications that require high-performance processing and reliable operation. Additionally, its ability to be programmed using HDL language provides a powerful and efficient platform for developing complex, high-performance applications. As the demand for intelligent systems increases, the XQ5VFX130T-2EF1738I chip model is likely to become a popular choice for a variety of applications.
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5,550 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||