
AMD Xilinx
XQ5VFX130T-1EF1738I
XQ5VFX130T-1EF1738I ECAD Model
XQ5VFX130T-1EF1738I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 840 | |
Number of Outputs | 840 | |
Number of Logic Cells | 131072 | |
Number of CLBs | 11200 | |
Combinatorial Delay of a CLB-Max | 900 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Clock Frequency-Max | 1.098 GHz | |
Power Supplies | 1,2.5 V | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B1738 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Number of Terminals | 1738 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1738,42X42,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | FCBGA-1738 | |
Pin Count | 1738 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.7.A | |
HTS Code | 8542.39.00.01 |
XQ5VFX130T-1EF1738I Datasheet Download
XQ5VFX130T-1EF1738I Overview
The XQ5VFX130T-1EF1738I chip model is a high-performance, low-power integrated circuit designed for use in a wide range of applications. It has a wide range of features that make it suitable for a variety of industries, including telecommunications, consumer electronics, and automotive. The chip model is designed to provide high-speed data transfer, low-power operation, and high-performance computing.
The XQ5VFX130T-1EF1738I chip model offers a number of advantages over other chip models. It has a low power consumption, making it ideal for applications that require long-term operation or require a high level of performance. The chip model also has a high-speed data transfer speed, making it suitable for applications that require fast data transfer. In addition, the chip model has a wide range of features, such as a built-in Ethernet controller and a low-power, low-noise analog front-end.
The XQ5VFX130T-1EF1738I chip model is expected to be in high demand in the future, due to its wide range of features and its ability to meet the needs of a variety of industries. It is expected to be used in a number of applications, including telecommunications, consumer electronics, and automotive. In addition, the chip model is expected to be used in networks, and in intelligent scenarios such as autonomous vehicles and the Internet of Things.
The product description of the XQ5VFX130T-1EF1738I chip model includes a wide range of features, such as a low-power, low-noise analog front-end, an Ethernet controller, and a high-speed data transfer speed. It is designed to meet a variety of design requirements, including low power consumption, high-speed data transfer, and high-performance computing.
In addition to its product description, the XQ5VFX130T-1EF1738I chip model has been used in a number of case studies. For example, it has been used in a number of automotive applications, such as autonomous vehicles, and in the Internet of Things. In addition, it has been used in a number of telecommunications applications, such as high-speed wireless networks.
When using the XQ5VFX130T-1EF1738I chip model, there are a few precautions that should be taken. For example, it is important to ensure that the chip model is properly installed and that the power supply is adequate for the application. In addition, it is important to ensure that the chip model is properly configured for the application, and that the chip model is compatible with the system it is being used in.
The XQ5VFX130T-1EF1738I chip model is a high-performance, low-power integrated circuit designed for use in a wide range of applications. It has a wide range of features that make it suitable for a variety of industries, and is expected to be in high demand in the future. It is expected to be used in a number of applications, including telecommunications, consumer electronics, and automotive. In addition, it can be used in networks, and in intelligent scenarios such as autonomous vehicles and the Internet of Things. When using the chip model, it is important to ensure that it is properly installed and configured, and that the power supply is adequate for the application.
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Pricing (USD)
QTY | Unit Price | Ext Price |
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