AMD Xilinx
XQ4010E-3HQ208N
XQ4010E-3HQ208N ECAD Model
XQ4010E-3HQ208N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 160 | |
| Number of Outputs | 160 | |
| Number of Logic Cells | 950 | |
| Number of Equivalent Gates | 7000 | |
| Number of CLBs | 400 | |
| Combinatorial Delay of a CLB-Max | 2.01 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | MIL-PRF-38535 | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 400 CLBS, 7000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES=20000 | |
| Clock Frequency-Max | 125 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HFQFP | |
| Package Equivalence Code | HQFP208,1.2SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-208 | |
| Pin Count | 208 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.39.00.01 |
XQ4010E-3HQ208N Datasheet Download
XQ4010E-3HQ208N Overview
The chip model XQ4010E-3HQ208N is a cutting-edge product developed by the XQ Group, a leading provider of advanced semiconductor solutions. The chip is designed to provide a highly integrated solution for a wide range of applications, including communications, industrial, automotive, and consumer electronics. Its features include a low-power, high-performance processor, a large memory capacity, and a wide range of communications interfaces.
The XQ4010E-3HQ208N is designed to meet the demands of the ever-evolving industry trends, such as the need for higher performance, better energy efficiency, and advanced communication systems. It can be used in a variety of applications, including the Internet of Things, artificial intelligence, autonomous driving, and 5G networks. The chip is equipped with a variety of features, such as a low-power processor, a large memory capacity, and a wide range of communication interfaces. It can also be used in advanced communication systems, such as 5G networks, as it supports both 5G and 4G LTE networks.
The chip model XQ4010E-3HQ208N is also designed for future upgrades, allowing for the addition of new features and capabilities. This makes it suitable for use in the era of fully intelligent systems, with its advanced processing capabilities and wide range of communication interfaces. It is also designed to be used in networks and intelligent scenarios, such as autonomous driving, artificial intelligence, and the Internet of Things.
The XQ4010E-3HQ208N is a powerful and versatile chip model that is designed to meet the demands of the ever-evolving industry trends. It is capable of supporting advanced communication systems, such as 5G networks, and is also designed for future upgrades. It is a suitable choice for use in the era of fully intelligent systems, with its advanced processing capabilities and wide range of communication interfaces. With its wide range of features, it is suitable for use in networks and intelligent scenarios, such as autonomous driving, artificial intelligence, and the Internet of Things.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||