AMD Xilinx
XQ2V1000-4FGG456N
XQ2V1000-4FGG456N ECAD Model
XQ2V1000-4FGG456N Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Equivalent Gates | 1000000 | |
| Number of CLBs | 1280 | |
| Combinatorial Delay of a CLB-Max | 440 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1280 CLBS, 1000000 GATES | |
| Clock Frequency-Max | 650 MHz | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 456 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XQ2V1000-4FGG456N Datasheet Download
XQ2V1000-4FGG456N Overview
The XQ2V1000-4FGG456N chip model is a powerful and versatile integrated circuit (IC) manufactured by a leading semiconductor company. It is designed to provide an array of features and functions for a wide range of applications, including advanced communication systems.
The original design intention of the XQ2V1000-4FGG456N was to provide a high-performance, cost-effective solution for various applications. It is capable of delivering high levels of performance, reliability, and scalability. The chip model has been designed with a focus on power efficiency, enabling it to be used in low-power, high-performance systems.
The XQ2V1000-4FGG456N chip model is equipped with several features and capabilities that make it suitable for use in advanced communication systems. It is capable of supporting multiple communication protocols, such as Ethernet, Wi-Fi, and Bluetooth. It also supports multiple data transfer speeds and is capable of providing high-speed data transfer rates up to 10Gbps.
The chip model is also capable of providing a wide range of features and functions, such as hardware-based encryption, secure boot, and secure firmware updates. It is also capable of providing robust security features, such as authentication and authorization. In addition, the chip model is capable of providing support for a wide range of communication protocols, such as Zigbee, LoRa, and Z-Wave.
The XQ2V1000-4FGG456N chip model is also capable of providing support for future upgrades and modifications. This allows for the chip model to be used in new and innovative applications. Additionally, the chip model is capable of being used in the development and popularization of future intelligent robots. To effectively use the chip model, technical talents, such as software engineers and hardware engineers, are needed.
To ensure the successful implementation of the XQ2V1000-4FGG456N chip model, there are certain precautions that must be taken. These include proper installation and maintenance of the chip model, as well as ensuring the correct configuration of the chip model. Additionally, it is important to ensure that the chip model is used in accordance with the manufacturer’s instructions and specifications.
In conclusion, the XQ2V1000-4FGG456N chip model is a powerful and versatile integrated circuit that is capable of providing a wide range of features and functions for a wide range of applications, including advanced communication systems. It is capable of providing support for future upgrades and modifications, as well as being used in the development and popularization of future intelligent robots. However, to ensure the successful implementation of the chip model, certain precautions must be taken, such as proper installation and maintenance of the chip model.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||