
AMD Xilinx
XQ17V16VQ44N
XQ17V16VQ44N ECAD Model
XQ17V16VQ44N Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Memory Density | 16.7772 Mbit | |
Memory Width | 8 | |
Organization | 2MX8 | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Power Supplies | 3.3 V | |
Access Time-Max | 20 ns | |
Clock Frequency-Max (fCLK) | 33 MHz | |
Memory IC Type | CONFIGURATION MEMORY | |
I/O Type | COMMON | |
Number of Functions | 1 | |
Number of Words Code | 2000000 | |
Number of Words | 2.0972 M | |
Operating Mode | SYNCHRONOUS | |
Output Characteristics | 3-STATE | |
Parallel/Serial | PARALLEL/SERIAL | |
Standby Current-Max | 1 mA | |
Supply Current-Max | 100 µA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 3 V | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
JESD-30 Code | S-PQFP-G44 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Peak Reflow Temperature (Cel) | 240 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 44 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TQFP | |
Package Equivalence Code | TQFP44,.47SQ,32 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, THIN PROFILE | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn85Pb15) | |
Terminal Form | GULL WING | |
Terminal Pitch | 800 µm | |
Terminal Position | QUAD | |
Seated Height-Max | 1.2 mm | |
Length | 10 mm | |
Width | 10 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | VQFP-44 | |
Pin Count | 44 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.32.00.61 |
XQ17V16VQ44N Datasheet Download
XQ17V16VQ44N Overview
The chip model XQ17V16VQ44N is a versatile and powerful solution for a variety of applications. It is a high-performance, low-power chip that offers a wide range of features, making it suitable for a variety of applications. It is a multi-core processor with a wide range of features, including high-speed memory access, advanced graphics processing, and high-speed data transfer.
The XQ17V16VQ44N chip model has several advantages over its competitors. It is designed to be energy efficient, reducing power consumption and increasing the efficiency of the system. It also has a high level of integration, allowing for smaller, more efficient designs. The chip also has a wide range of features, including advanced graphics processing, high-speed memory access, and high-speed data transfer.
The XQ17V16VQ44N chip model is expected to be in high demand in the near future, as it can be used in a variety of applications. It is ideal for networks, as it is capable of providing fast and reliable connections. It can also be used in intelligent systems, such as those used in autonomous vehicles and robotics, as it can process data quickly and accurately.
The product description and specific design requirements of the XQ17V16VQ44N chip model are quite extensive. It is designed to be energy efficient, with a low power consumption and a high level of integration. The chip also has a wide range of features, including high-speed memory access, advanced graphics processing, and high-speed data transfer. It is also designed to be compatible with a variety of operating systems, including Windows, Linux, and Mac OS.
Real-world case studies have been conducted to test the performance of the XQ17V16VQ44N chip model. The results of these studies have been positive, with the chip performing as expected in a variety of scenarios. However, there are some precautions that should be taken when using the chip. It is important to ensure that the chip is properly cooled, as it can become overheated if not properly managed. Additionally, the chip should be monitored to ensure that it is running at its optimal speed.
In conclusion, the XQ17V16VQ44N chip model is a powerful and versatile solution for a variety of applications. It is designed to be energy efficient, with a low power consumption and a high level of integration. It is also capable of providing fast and reliable connections, as well as being able to process data quickly and accurately. Furthermore, the chip is expected to be in high demand in the near future, as it can be used in a variety of applications.
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