AMD Xilinx
XCZU9EG-L2FFVB1156E
XCZU9EG-L2FFVB1156E ECAD Model
XCZU9EG-L2FFVB1156E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 720 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | |
| Supply Voltage-Max | 742 mV | |
| Supply Voltage-Min | 698 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B1156 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 110 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FCBGA-1156 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU9EG-L2FFVB1156E Datasheet Download
XCZU9EG-L2FFVB1156E Overview
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In terms of product description and design requirements, the chip model XCZU9EG-L2FFVB1156E is designed to meet the needs of the most demanding projects. It is designed to be highly reliable and versatile, and is designed to meet the needs of the most demanding applications. It is designed to be able to handle the most demanding tasks with the highest level of performance.
In terms of actual case studies and precautions, the chip model XCZU9EG-L2FFVB1156E is designed to be highly reliable and versatile, and is designed to meet the needs of the most demanding applications. It is designed to be able to handle the most demanding tasks with the highest level of performance. It is designed to be able to handle the most demanding tasks with the highest level of performance, and is designed to be able to handle the most demanding tasks with the highest level of performance.
Overall, the chip model XCZU9EG-L2FFVB1156E is a cutting-edge device with a wide range of applications. It is designed to meet the needs of the most demanding projects, and its features make it suitable for a variety of industries, including networking, automotive, and industrial control. It is designed to be highly reliable and versatile, and is designed to meet the needs of the most demanding applications. It is designed to be able to handle the most demanding tasks with the highest level of performance, and is designed to be able to handle the most demanding tasks with the highest level of performance. It is also designed to be able to handle the most demanding tasks with the highest level of performance in the era of fully intelligent systems.
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4,015 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,175.9119 | $2,175.9119 |
| 10+ | $2,152.5150 | $21,525.1498 |
| 100+ | $2,035.5305 | $203,553.0474 |
| 1000+ | $1,918.5460 | $959,272.9820 |
| 10000+ | $1,754.7677 | $1,754,767.6500 |
| The price is for reference only, please refer to the actual quotation! | ||