
AMD Xilinx
XCZU9EG-L1FFVB1156I
XCZU9EG-L1FFVB1156I ECAD Model
XCZU9EG-L1FFVB1156I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 720 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | |
Supply Voltage-Max | 742 mV | |
Supply Voltage-Min | 698 mV | |
Temperature Grade | INDUSTRIAL | |
JESD-30 Code | R-PBGA-B1156 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1156 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | FCBGA-1156 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU9EG-L1FFVB1156I Datasheet Download
XCZU9EG-L1FFVB1156I Overview
The XCZU9EG-L1FFVB1156I is a high-performance chip model that is suitable for a variety of applications, such as digital signal processing, embedded processing, and image processing. It is designed to use the HDL language, which is an advanced language used in the development of digital systems. This model offers a number of advantages over its competitors, including a high level of processing power, low power consumption, and a wide range of features.
The XCZU9EG-L1FFVB1156I is an ideal choice for those who require a powerful and reliable chip model. It is suitable for a variety of applications, including high-performance digital signal processing, embedded processing, and image processing. The chip model also offers a number of features that make it a great choice for those who need a reliable and powerful chip model. For example, the chip model has a low power consumption, which makes it an ideal choice for those looking to save on energy costs.
The XCZU9EG-L1FFVB1156I is expected to be in high demand in the near future, due to its advanced features and capabilities. It is also expected to be a popular choice for those who require a reliable and powerful chip model for their applications. As the demand for this chip model increases, it is likely that the price of the chip model will decrease as well.
When it comes to designing a system using the XCZU9EG-L1FFVB1156I chip model, there are a few important considerations to keep in mind. First, it is important to ensure that the design is compatible with the HDL language, as this is the language used to program the chip model. Additionally, it is important to consider the specific design requirements of the chip model, such as the memory size, clock speed, and power consumption. It is also important to consider any additional features that may be required for the specific application.
Finally, it is also important to consider any case studies and precautions when designing a system using the XCZU9EG-L1FFVB1156I chip model. Case studies can provide valuable insight into how the chip model performs in a variety of applications, and can help to identify any potential issues. Additionally, precautions should be taken to ensure that the system is properly tested and verified before it is deployed. This will help to ensure that the system is reliable and performs as expected.
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3,103 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $1,903.6919 | $1,903.6919 |
10+ | $1,883.2221 | $18,832.2206 |
100+ | $1,780.8730 | $178,087.3035 |
1000+ | $1,678.5240 | $839,262.0050 |
10000+ | $1,535.2354 | $1,535,235.3750 |
The price is for reference only, please refer to the actual quotation! |