
AMD Xilinx
XCZU9EG-3FFVC900E
XCZU9EG-3FFVC900E ECAD Model
XCZU9EG-3FFVC900E Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 900 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Supply Voltage-Max | 927 mV | |
Supply Voltage-Min | 873 mV | |
Temperature Grade | OTHER | |
JESD-30 Code | R-PBGA-B900 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 900 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA900,30X30,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU9EG-3FFVC900E Datasheet Download
XCZU9EG-3FFVC900E Overview
The chip model XCZU9EG-3FFVC900E is a powerful and efficient processor designed for high-performance computing applications. It is manufactured by Xilinx, a leader in programmable logic solutions. This model is based on the Zynq UltraScale+ MPSoC architecture and is designed for high-speed data processing, networking, and embedded systems. The XCZU9EG-3FFVC900E offers a wide range of features and capabilities, including support for multiple communication protocols, a variety of memory options, and advanced hardware acceleration.
The XCZU9EG-3FFVC900E has already been widely adopted in the industry, and its popularity is expected to increase in the future. This is due to its ability to provide high-performance computing solutions at a lower cost than traditional solutions. It is also expected to be used in a variety of applications, such as industrial automation, automotive, medical, and consumer electronics. The chip model is also expected to be used in the development of 5G networks and the Internet of Things (IoT), providing a platform for connecting devices and systems.
The XCZU9EG-3FFVC900E is also expected to be used in the development of intelligent systems. This is due to its ability to process large amounts of data quickly and accurately. It can be used in a variety of scenarios, such as machine learning, natural language processing, image recognition, and autonomous vehicles. The chip model is also suitable for use in the era of fully intelligent systems, as it can provide the processing power and flexibility needed for such applications.
In conclusion, the XCZU9EG-3FFVC900E is a powerful and efficient processor designed for high-performance computing applications. It is expected to be widely used in the industry in the future, as it offers a wide range of features and capabilities, including support for multiple communication protocols, a variety of memory options, and advanced hardware acceleration. The chip model is also expected to be used in the development of 5G networks and the Internet of Things (IoT), as well as in the development of intelligent systems. It is suitable for use in the era of fully intelligent systems, as it can provide the processing power and flexibility needed for such applications.
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4,032 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $2,346.8985 | $2,346.8985 |
10+ | $2,321.6631 | $23,216.6306 |
100+ | $2,195.4857 | $219,548.5716 |
1000+ | $2,069.3084 | $1,034,654.1880 |
10000+ | $1,892.6601 | $1,892,660.1000 |
The price is for reference only, please refer to the actual quotation! |