XCZU9EG-3FFVB1156E
XCZU9EG-3FFVB1156E
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XCZU9EG-3FFVB1156E


XCZU9EG-3FFVB1156E
F20-XCZU9EG-3FFVB1156E
Active
CMOS, BGA, BGA1156,34X34,40
BGA, BGA1156,34X34,40

XCZU9EG-3FFVB1156E ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

XCZU9EG-3FFVB1156E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 900 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 927 mV
Supply Voltage-Min 873 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B1156
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA1156,34X34,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU9EG-3FFVB1156E Datasheet Download


XCZU9EG-3FFVB1156E Overview



The XCZU9EG-3FFVB1156E chip model is a high-performance, low-power, and cost-effective programmable logic device from Xilinx. It is designed to be used for digital signal processing, embedded processing, image processing, and other applications that require the use of HDL (Hardware Description Language). The original design intention of this chip model was to provide a powerful and efficient platform for system designers to quickly develop their applications.


The XCZU9EG-3FFVB1156E chip model can be easily modified and upgraded to meet the demands of the ever-changing landscape of technology. It is capable of being applied to advanced communication systems, networks, and intelligent scenarios. It is also possible to use this chip model in the era of fully intelligent systems, as it is equipped with powerful features such as high-performance computing, real-time processing, and low-power consumption.


The XCZU9EG-3FFVB1156E chip model is an ideal choice for those who are looking for a reliable and cost-effective solution for their projects. Its powerful features and flexibility make it a great choice for a variety of applications. With its ability to be upgraded and modified, this chip model is sure to be a valuable asset for any system designer. Its ability to be applied to advanced communication systems, networks, and intelligent scenarios makes it a great choice for those who are looking to stay ahead of the curve in this rapidly changing world.



2,920 In Stock


I want to buy

Unit Price: $4,227.264
The price is for reference only.
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
1+ $3,931.3555 $3,931.3555
10+ $3,889.0829 $38,890.8288
100+ $3,677.7197 $367,771.9680
1000+ $3,466.3565 $1,733,178.2400
10000+ $3,170.4480 $3,170,448.0000
The price is for reference only, please refer to the actual quotation!

Quick Quote