AMD Xilinx
XCZU9EG-2FFVB1156E
XCZU9EG-2FFVB1156E ECAD Model
XCZU9EG-2FFVB1156E Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B1156 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 3.42 mm | |
| Width | 35 mm | |
| Length | 35 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA1156,34X34,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2017-02-15 |
XCZU9EG-2FFVB1156E Datasheet Download
XCZU9EG-2FFVB1156E Overview
The XCZU9EG-2FFVB1156E chip model is a powerful and versatile model that is suitable for a variety of applications. It is specifically designed for high-performance digital signal processing, embedded processing, and image processing. The chip model is able to handle complex tasks and requires the use of HDL language.
The original design intention of the XCZU9EG-2FFVB1156E chip model was to provide a powerful and reliable solution to the needs of a variety of applications. The chip model is designed with the possibility of future upgrades, allowing it to be used in more advanced communication systems.
The XCZU9EG-2FFVB1156E chip model is also applicable to the development and popularization of future intelligent robots. The chip model can provide the necessary processing power and reliability for the development of these robots. To use the model effectively, technical talents such as software engineers, system architects, and embedded engineers are needed to develop the necessary programs and systems.
Overall, the XCZU9EG-2FFVB1156E chip model is a powerful and versatile model that is suitable for a variety of applications. It is designed with the possibility of future upgrades, allowing it to be used in more advanced communication systems. The chip model is also applicable to the development and popularization of future intelligent robots, requiring the use of technical talents to use the model effectively.
You May Also Be Interested In
5,013 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,822.2301 | $2,822.2301 |
| 10+ | $2,791.8835 | $27,918.8352 |
| 100+ | $2,640.1507 | $264,015.0720 |
| 1000+ | $2,488.4179 | $1,244,208.9600 |
| 10000+ | $2,275.9920 | $2,275,992.0000 |
| The price is for reference only, please refer to the actual quotation! | ||