AMD Xilinx
XCZU9EG-1FFVC900E
XCZU9EG-1FFVC900E ECAD Model
XCZU9EG-1FFVC900E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA900,30X30,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU9EG-1FFVC900E Datasheet Download
XCZU9EG-1FFVC900E Overview
The XCZU9EG-1FFVC900E chip model is a powerful tool for a variety of applications, from high-performance digital signal processing to embedded processing and image processing. It is designed to be used with the HDL language, and its original design intention was to provide a powerful and reliable platform for advanced communication systems.
The XCZU9EG-1FFVC900E chip model has a wide range of features and capabilities, making it suitable for a variety of applications. It has a high-speed, low-power architecture that makes it ideal for digital signal processing applications. It also has a wide range of peripherals, including Ethernet, USB, and other high-speed communication interfaces. It also has a large number of memory resources and a wide range of on-chip logic, making it suitable for embedded processing and image processing.
The product description of the XCZU9EG-1FFVC900E chip model includes a detailed list of its features and capabilities, along with instructions on how to use it. It also includes a detailed description of the design requirements, including the clock speed, memory size, and other parameters. The product description also includes a list of case studies and best practices for using the chip model.
The XCZU9EG-1FFVC900E chip model is designed for flexibility and upgradability. It is designed to be easily upgraded with new features and capabilities, allowing it to be used for a wide range of applications. It is also designed to be able to handle advanced communication systems, making it suitable for a variety of applications.
When using the XCZU9EG-1FFVC900E chip model, it is important to follow the product description and design requirements closely. It is also important to be aware of the limitations of the chip model, as well as any potential risks associated with using it. It is also important to be aware of the potential for future upgrades and changes, as these could affect the performance of the chip model.
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2,726 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,784.4840 | $1,784.4840 |
| 10+ | $1,765.2960 | $17,652.9600 |
| 100+ | $1,669.3560 | $166,935.6000 |
| 1000+ | $1,573.4160 | $786,708.0000 |
| 10000+ | $1,439.1000 | $1,439,100.0000 |
| The price is for reference only, please refer to the actual quotation! | ||