XCZU9CG-L2FFVC900E
XCZU9CG-L2FFVC900E
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rohs

AMD Xilinx

XCZU9CG-L2FFVC900E


XCZU9CG-L2FFVC900E
F20-XCZU9CG-L2FFVC900E
Active
CMOS, BGA, BGA900,30X30,40
BGA, BGA900,30X30,40

XCZU9CG-L2FFVC900E ECAD Model


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XCZU9CG-L2FFVC900E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 720 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
Supply Voltage-Max 742 mV
Supply Voltage-Min 698 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B900
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 110 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA900,30X30,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU9CG-L2FFVC900E Datasheet Download


XCZU9CG-L2FFVC900E Overview



The XCZU9CG-L2FFVC900E is a versatile chip model that is suitable for a variety of high-performance applications, such as digital signal processing, embedded processing, and image processing. It requires the use of HDL language for its design and implementation.


The XCZU9CG-L2FFVC900E was designed with the intention of providing a powerful and reliable solution for high-performance applications. It is highly scalable, allowing for future upgrades and modifications to suit the needs of the user. It can also be used for advanced communication systems, providing the necessary features and performance.


The XCZU9CG-L2FFVC900E is a robust chip model that offers a wide range of features and performance. Its design includes a wide range of integrated components, such as a high-performance processor, multiple memory controllers, and a high-speed serial interface. It also supports a variety of communication protocols and can be used for a variety of applications.


When designing with the XCZU9CG-L2FFVC900E, it is important to consider the specific requirements of the application. This includes the type of processor, the type of memory controllers, the type of serial interface, and the communication protocols. It is also important to consider the power consumption, the size of the chip, and the cost.


Case studies of the XCZU9CG-L2FFVC900E can be found in a variety of publications and websites. These case studies provide an in-depth look at how the chip has been used in different applications and the performance results. Additionally, these case studies can provide valuable insight into the design and implementation of the chip.


When using the XCZU9CG-L2FFVC900E, it is important to follow all safety precautions. This includes proper handling and storage of the chip, as well as the use of appropriate tools and techniques. Additionally, it is important to ensure that the chip is properly connected and configured. Failure to do so can lead to damage to the chip and the system.


The XCZU9CG-L2FFVC900E is a powerful and reliable chip model that can be used for a variety of high-performance applications. Its design and implementation require careful consideration of the specific requirements of the application. Additionally, it is important to follow all safety precautions and use appropriate tools and techniques. With proper care and attention, the XCZU9CG-L2FFVC900E can provide a powerful and reliable solution for a variety of applications.



1,109 In Stock


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Unit Price: $12,150.4664
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $11,299.9338 $11,299.9338
10+ $11,178.4291 $111,784.2909
100+ $10,570.9058 $1,057,090.5768
1000+ $9,963.3824 $4,981,691.2240
10000+ $9,112.8498 $9,112,849.8000
The price is for reference only, please refer to the actual quotation!

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