AMD Xilinx
XCZU9CG-L1FFVB1156I
XCZU9CG-L1FFVB1156I ECAD Model
XCZU9CG-L1FFVB1156I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 720 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | |
| Supply Voltage-Max | 742 mV | |
| Supply Voltage-Min | 698 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B1156 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FCBGA-1156 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU9CG-L1FFVB1156I Datasheet Download
XCZU9CG-L1FFVB1156I Overview
The XCZU9CG-L1FFVB1156I chip model is a powerful tool for digital signal processing, embedded processing, and image processing. It is designed to be used with a HDL language, making it an ideal choice for a wide range of applications. Its impressive performance and advanced features make it suitable for a variety of tasks, from high-end industrial and commercial applications to consumer electronics.
The industry trends that the XCZU9CG-L1FFVB1156I chip model is part of are constantly evolving. As technology advances, new technologies are required to support the application environment. This chip model is designed to be able to keep up with the latest trends, allowing it to remain a reliable and effective tool for many years to come.
The XCZU9CG-L1FFVB1156I chip model is also suitable for use in networks and intelligent scenarios. It is capable of supporting a variety of applications, from simple network management to complex artificial intelligence tasks. As the world moves towards a fully intelligent system, this chip model will be an invaluable asset for those looking to stay ahead of the curve.
Overall, the XCZU9CG-L1FFVB1156I chip model is an impressive tool that can be used for a wide range of tasks. Its ability to keep up with the latest industry trends, as well as its potential for use in networks and intelligent scenarios, make it a powerful and reliable tool for many years to come.
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4,683 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,758.0132 | $1,758.0132 |
| 10+ | $1,739.1099 | $17,391.0986 |
| 100+ | $1,644.5930 | $164,459.3016 |
| 1000+ | $1,550.0762 | $775,038.0880 |
| 10000+ | $1,417.7526 | $1,417,752.6000 |
| The price is for reference only, please refer to the actual quotation! | ||