
AMD Xilinx
XCZU9CG-2FFVB1156E
XCZU9CG-2FFVB1156E ECAD Model
XCZU9CG-2FFVB1156E Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 850 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Supply Voltage-Max | 876 mV | |
Supply Voltage-Min | 825 mV | |
Temperature Grade | OTHER | |
JESD-30 Code | R-PBGA-B1156 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1156 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Seated Height-Max | 3.42 mm | |
Width | 35 mm | |
Length | 35 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA1156,34X34,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 | |
Date Of Intro | 2017-02-15 |
XCZU9CG-2FFVB1156E Datasheet Download
XCZU9CG-2FFVB1156E Overview
The XCZU9CG-2FFVB1156E chip model is a powerful, versatile, and cost-effective solution for a wide range of applications. It is a highly integrated device that combines a powerful processing core with a wide range of peripherals, memory, and I/O interfaces. This makes it an ideal choice for many industries, including automotive, industrial, medical, and consumer electronics.
The XCZU9CG-2FFVB1156E chip model offers a number of advantages over other solutions. It is designed to be energy efficient, allowing for lower power consumption and longer battery life. It is also highly programmable, allowing for custom solutions to be developed quickly and easily. Additionally, its low cost makes it a great option for many applications where cost is a major consideration.
As the demand for more advanced, intelligent solutions continues to grow, the XCZU9CG-2FFVB1156E chip model is well-positioned to meet the needs of many industries. It is well-suited for use in networks, as it can be used to process data quickly and accurately. It can also be used in intelligent scenarios, such as facial recognition, machine learning, and natural language processing. Additionally, it is well-suited for use in the development and popularization of future intelligent robots.
Using the XCZU9CG-2FFVB1156E chip model effectively requires a certain level of technical expertise. It is important to have a good understanding of the architecture of the chip and its various components. Additionally, it is important to have a good understanding of the programming language used to develop solutions for the chip. Finally, it is important to have a good understanding of the different types of I/O interfaces and peripherals that can be used with the chip.
In conclusion, the XCZU9CG-2FFVB1156E chip model is a powerful and cost-effective solution for many industries. It offers a number of advantages over other solutions, including low power consumption, programmability, and cost. It is well-suited for use in networks and intelligent scenarios, and can be used in the development and popularization of future intelligent robots. To use the model effectively, however, requires a certain level of technical expertise.
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5,162 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $1,758.0132 | $1,758.0132 |
10+ | $1,739.1099 | $17,391.0986 |
100+ | $1,644.5930 | $164,459.3016 |
1000+ | $1,550.0762 | $775,038.0880 |
10000+ | $1,417.7526 | $1,417,752.6000 |
The price is for reference only, please refer to the actual quotation! |