AMD Xilinx
XCZU7EV-L2FFVC1156E
XCZU7EV-L2FFVC1156E ECAD Model
XCZU7EV-L2FFVC1156E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 720 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | |
| Supply Voltage-Max | 742 mV | |
| Supply Voltage-Min | 698 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B1156 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 110 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA1156,34X34,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU7EV-L2FFVC1156E Datasheet Download
XCZU7EV-L2FFVC1156E Overview
The XCZU7EV-L2FFVC1156E chip model is a powerful and versatile model designed for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with HDL language, which is a hardware description language used to describe the behavior of digital circuits. This chip model is designed for applications that require high performance and reliability.
The chip model XCZU7EV-L2FFVC1156E is designed to meet the needs of the current industry trends, and its performance and reliability are expected to keep up with the increasing demands of the industry. It is also designed with the capability to be upgraded in the future, so that it can be used in advanced communication systems.
The original design intention of the XCZU7EV-L2FFVC1156E chip model is to provide a reliable and high-performance platform for digital signal processing, embedded processing, and image processing. It is designed to be used with HDL language, which is a hardware description language used to describe the behavior of digital circuits. This chip model is designed for applications that require high performance and reliability.
The XCZU7EV-L2FFVC1156E chip model is designed to meet the needs of the current industry trends. It is also designed with the capability to be upgraded in the future, so that it can be used in advanced communication systems. To ensure that the application environment can support the new technologies, the chip model must be designed to support the latest technologies.
The XCZU7EV-L2FFVC1156E chip model is designed to provide a reliable and high-performance platform for digital signal processing, embedded processing, and image processing. It is capable of meeting the current industry trends and can be upgraded in the future to support advanced communication systems. With its support for the latest technologies, the chip model can be used in a wide range of applications and is a great choice for those looking for a reliable and high-performance solution.
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1,132 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,198.9272 | $2,198.9272 |
| 10+ | $2,175.2828 | $21,752.8278 |
| 100+ | $2,057.0609 | $205,706.0886 |
| 1000+ | $1,938.8390 | $969,419.4980 |
| 10000+ | $1,773.3284 | $1,773,328.3500 |
| The price is for reference only, please refer to the actual quotation! | ||