AMD Xilinx
XCZU7EV-L1FBVB900I
XCZU7EV-L1FBVB900I ECAD Model
XCZU7EV-L1FBVB900I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 720 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | |
| Supply Voltage-Max | 742 mV | |
| Supply Voltage-Min | 698 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA900,30X30,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU7EV-L1FBVB900I Datasheet Download
XCZU7EV-L1FBVB900I Overview
The chip model XCZU7EV-L1FBVB900I is a new technology in the chip industry, which is designed to meet the needs of the modern world. It is a powerful and versatile device, capable of providing high-performance computing capabilities. It is designed to be used in a variety of applications, including robotics, artificial intelligence, and machine learning.
The XCZU7EV-L1FBVB900I is a cutting-edge chip model that supports the latest technologies, including high-speed data transfer, advanced security features, and low-power consumption. It is also capable of providing a wide array of features, such as high-resolution graphics, advanced audio processing, and advanced motion sensing.
In terms of industry trends, the XCZU7EV-L1FBVB900I is expected to be widely adopted in the future, as it is capable of providing the necessary features for the development and popularization of future intelligent robots. It is also capable of providing the necessary features for the application of artificial intelligence and machine learning.
In terms of application environment, the XCZU7EV-L1FBVB900I is designed to be used in a variety of applications, such as robotics, artificial intelligence, and machine learning. It is also capable of providing the necessary features for the development and popularization of future intelligent robots.
In order to effectively use the XCZU7EV-L1FBVB900I, it is important to understand its product description and specific design requirements. It is also important to be aware of the actual case studies and precautions that should be taken when using the chip model. Furthermore, it is important to be aware of the technical talents that are needed to effectively use the chip model.
Overall, the XCZU7EV-L1FBVB900I is a cutting-edge chip model that is expected to be widely adopted in the future. It is capable of providing the necessary features for the development and popularization of future intelligent robots, and it is important to understand its product description and design requirements in order to effectively use the chip model. Furthermore, it is important to be aware of the actual case studies and precautions that should be taken when using the chip model, as well as the technical talents that are needed to effectively use the chip model.
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3,575 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,510.0189 | $1,510.0189 |
| 10+ | $1,493.7821 | $14,937.8210 |
| 100+ | $1,412.5983 | $141,259.8294 |
| 1000+ | $1,331.4145 | $665,707.2420 |
| 10000+ | $1,217.7572 | $1,217,757.1500 |
| The price is for reference only, please refer to the actual quotation! | ||