XCZU7EV-3FFVC1156E
XCZU7EV-3FFVC1156E
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XCZU7EV-3FFVC1156E


XCZU7EV-3FFVC1156E
F20-XCZU7EV-3FFVC1156E
Active
CMOS, BGA, BGA1156,34X34,40
BGA, BGA1156,34X34,40

XCZU7EV-3FFVC1156E ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

XCZU7EV-3FFVC1156E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 900 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 927 mV
Supply Voltage-Min 873 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B1156
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA1156,34X34,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU7EV-3FFVC1156E Datasheet Download


XCZU7EV-3FFVC1156E Overview



XCZU7EV-3FFVC1156E is a powerful chip model developed by Xilinx, which is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, image processing, and more. It is designed to be used with the HDL language, which is a hardware description language that can be used to create complex logic designs.


The original design intention of the XCZU7EV-3FFVC1156E was to provide a powerful and efficient platform for a variety of applications. Its design is based on the Virtex UltraScale+ FPGA, which provides a high-performance, low-power platform for advanced digital signal processing, embedded processing, and image processing. It also has the capability to be upgraded in the future, making it a great choice for future-proof applications.


The XCZU7EV-3FFVC1156E is an ideal choice for advanced communication systems. It is designed to provide a high-performance, low-power platform for a variety of applications. It is designed to be used with the HDL language, which allows for complex logic designs. It also has the capability to be upgraded in the future, making it a great choice for future-proof applications.


The product description of the XCZU7EV-3FFVC1156E includes a variety of features, such as a high-performance, low-power platform, a wide range of I/O capabilities, and a wide range of memory options. It is also designed to be used with the HDL language, which allows for complex logic designs. Additionally, it has the capability to be upgraded in the future, making it a great choice for future-proof applications.


When designing with the XCZU7EV-3FFVC1156E, it is important to consider the specific design requirements. This includes choosing the appropriate I/O, memory, and other components, as well as considering the power and performance requirements. Additionally, it is important to consider the future upgradeability of the chip, as well as any potential design limitations.


To demonstrate the capabilities of the XCZU7EV-3FFVC1156E, there have been several case studies that have been conducted. These case studies have shown that the XCZU7EV-3FFVC1156E is an ideal choice for a variety of applications, including high-performance digital signal processing, embedded processing, and image processing. Additionally, the case studies have also shown that the XCZU7EV-3FFVC1156E is capable of being upgraded in the future, making it a great choice for future-proof applications.


In conclusion, the XCZU7EV-3FFVC1156E is a powerful chip model developed by Xilinx. It is designed to be used with the HDL language, which allows for complex logic designs. It is an ideal choice for a variety of applications, including high-performance digital signal processing, embedded processing, and image processing. Additionally, it has the capability to be upgraded in the future, making it a great choice for future-proof applications.



1,493 In Stock


I want to buy

Unit Price: $2,596.5591
The price is for reference only.
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
1+ $2,414.8000 $2,414.8000
10+ $2,388.8344 $23,888.3437
100+ $2,259.0064 $225,900.6417
1000+ $2,129.1785 $1,064,589.2310
10000+ $1,947.4193 $1,947,419.3250
The price is for reference only, please refer to the actual quotation!

Quick Quote