
AMD Xilinx
XCZU7EV-3FFVC1156E
XCZU7EV-3FFVC1156E ECAD Model
XCZU7EV-3FFVC1156E Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 900 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Supply Voltage-Max | 927 mV | |
Supply Voltage-Min | 873 mV | |
Temperature Grade | OTHER | |
JESD-30 Code | R-PBGA-B1156 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1156 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA1156,34X34,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU7EV-3FFVC1156E Datasheet Download
XCZU7EV-3FFVC1156E Overview
XCZU7EV-3FFVC1156E is a powerful chip model developed by Xilinx, which is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, image processing, and more. It is designed to be used with the HDL language, which is a hardware description language that can be used to create complex logic designs.
The original design intention of the XCZU7EV-3FFVC1156E was to provide a powerful and efficient platform for a variety of applications. Its design is based on the Virtex UltraScale+ FPGA, which provides a high-performance, low-power platform for advanced digital signal processing, embedded processing, and image processing. It also has the capability to be upgraded in the future, making it a great choice for future-proof applications.
The XCZU7EV-3FFVC1156E is an ideal choice for advanced communication systems. It is designed to provide a high-performance, low-power platform for a variety of applications. It is designed to be used with the HDL language, which allows for complex logic designs. It also has the capability to be upgraded in the future, making it a great choice for future-proof applications.
The product description of the XCZU7EV-3FFVC1156E includes a variety of features, such as a high-performance, low-power platform, a wide range of I/O capabilities, and a wide range of memory options. It is also designed to be used with the HDL language, which allows for complex logic designs. Additionally, it has the capability to be upgraded in the future, making it a great choice for future-proof applications.
When designing with the XCZU7EV-3FFVC1156E, it is important to consider the specific design requirements. This includes choosing the appropriate I/O, memory, and other components, as well as considering the power and performance requirements. Additionally, it is important to consider the future upgradeability of the chip, as well as any potential design limitations.
To demonstrate the capabilities of the XCZU7EV-3FFVC1156E, there have been several case studies that have been conducted. These case studies have shown that the XCZU7EV-3FFVC1156E is an ideal choice for a variety of applications, including high-performance digital signal processing, embedded processing, and image processing. Additionally, the case studies have also shown that the XCZU7EV-3FFVC1156E is capable of being upgraded in the future, making it a great choice for future-proof applications.
In conclusion, the XCZU7EV-3FFVC1156E is a powerful chip model developed by Xilinx. It is designed to be used with the HDL language, which allows for complex logic designs. It is an ideal choice for a variety of applications, including high-performance digital signal processing, embedded processing, and image processing. Additionally, it has the capability to be upgraded in the future, making it a great choice for future-proof applications.
You May Also Be Interested In
1,493 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $2,414.8000 | $2,414.8000 |
10+ | $2,388.8344 | $23,888.3437 |
100+ | $2,259.0064 | $225,900.6417 |
1000+ | $2,129.1785 | $1,064,589.2310 |
10000+ | $1,947.4193 | $1,947,419.3250 |
The price is for reference only, please refer to the actual quotation! |