AMD Xilinx
XCZU7EV-3FBVB900E
XCZU7EV-3FBVB900E ECAD Model
XCZU7EV-3FBVB900E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 900 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 927 mV | |
| Supply Voltage-Min | 873 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA900,30X30,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU7EV-3FBVB900E Datasheet Download
XCZU7EV-3FBVB900E Overview
The XCZU7EV-3FBVB900E chip model is a highly efficient and powerful chip designed for high-performance digital signal processing, embedded processing, and image processing. It is developed with the latest technologies and is compatible with the HDL language. This chip is designed to meet the needs of various industries, providing a reliable and cost-effective solution for their needs.
The chip model XCZU7EV-3FBVB900E is designed to provide superior performance for a variety of industries, including automotive, aerospace, medical, and consumer electronics. It is capable of handling complex tasks, such as image processing, data analysis, and artificial intelligence. This chip model is also highly reliable, providing a stable platform for the development of new applications.
The XCZU7EV-3FBVB900E chip model is designed to be compatible with the latest technologies and standards. This ensures that the chip is able to operate in any environment, regardless of the technology being used. This also ensures that the chip is able to keep up with the latest trends in the industry.
The XCZU7EV-3FBVB900E chip model is also designed to be cost-effective. This chip model is designed to provide a reliable solution at an affordable price. This makes it an attractive option for businesses that need a reliable solution without breaking the bank.
The XCZU7EV-3FBVB900E chip model is expected to be in high demand in the future as the need for high-performance digital signal processing, embedded processing, and image processing continues to grow. This chip model is designed to provide a reliable and cost-effective solution for businesses that need a reliable solution without breaking the bank. As the demand for this chip model increases, the need for new technologies to support it will also increase. This chip model is expected to remain in high demand for many years to come.
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1,868 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,175.2946 | $2,175.2946 |
| 10+ | $2,151.9044 | $21,519.0438 |
| 100+ | $2,034.9531 | $203,495.3055 |
| 1000+ | $1,918.0017 | $959,000.8650 |
| 10000+ | $1,754.2699 | $1,754,269.8750 |
| The price is for reference only, please refer to the actual quotation! | ||