AMD Xilinx
XCZU7EV-2FFVC1156E
XCZU7EV-2FFVC1156E ECAD Model
XCZU7EV-2FFVC1156E Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B1156 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 3.51 mm | |
| Width | 35 mm | |
| Length | 35 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA1156,34X34,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2017-02-15 |
XCZU7EV-2FFVC1156E Datasheet Download
XCZU7EV-2FFVC1156E Overview
The chip model XCZU7EV-2FFVC1156E is a new type of model that has been developed by the semiconductor industry in recent years. It has the potential to play a major role in the development of future networks and intelligent scenarios. As the chip model continues to evolve, it is becoming increasingly important to understand the industry trends and the potential applications of the chip model.
The XCZU7EV-2FFVC1156E model is a field programmable gate array (FPGA) chip that is used to provide the necessary computing power for a wide range of applications. It is based on a 16nm FinFET process technology, and has a rich set of features, including high-speed transceivers, high-speed memory interfaces, and high-speed DSP blocks. These features make it suitable for a variety of applications, including high-performance computing, artificial intelligence, and machine learning.
In terms of industry trends, the XCZU7EV-2FFVC1156E model is expected to be widely used in the development of future intelligent systems. This is due to its ability to provide the necessary computing power to support the development of these intelligent systems. It is also expected to be used in the development of robots, as it can provide the necessary computing power to enable robots to perform complex tasks.
In terms of application environment, the XCZU7EV-2FFVC1156E model is expected to require the support of new technologies in order to be used effectively. This means that technical talents with knowledge of the latest technologies will be needed in order to use the model effectively. This includes knowledge of artificial intelligence and machine learning, as well as knowledge of high-speed memory interfaces and high-speed DSP blocks.
In conclusion, the XCZU7EV-2FFVC1156E model has the potential to play a major role in the development of networks and intelligent scenarios in the future. It is expected to require the support of new technologies in order to be used effectively, and technical talents with knowledge of the latest technologies will be needed in order to use the model effectively. As the chip model continues to evolve, it is becoming increasingly important to understand the industry trends and the potential applications of the chip model.
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2,946 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,733.9397 | $1,733.9397 |
| 10+ | $1,715.2952 | $17,152.9520 |
| 100+ | $1,622.0726 | $162,207.2631 |
| 1000+ | $1,528.8501 | $764,425.0330 |
| 10000+ | $1,398.3385 | $1,398,338.4750 |
| The price is for reference only, please refer to the actual quotation! | ||