XCZU7EV-2FBVB900I
XCZU7EV-2FBVB900I
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rohs

AMD Xilinx

XCZU7EV-2FBVB900I


XCZU7EV-2FBVB900I
F20-XCZU7EV-2FBVB900I
Active
CMOS, BGA, BGA900,30X30,40
BGA, BGA900,30X30,40

XCZU7EV-2FBVB900I ECAD Model


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XCZU7EV-2FBVB900I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B900
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA900,30X30,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU7EV-2FBVB900I Datasheet Download


XCZU7EV-2FBVB900I Overview



The XCZU7EV-2FBVB900I chip model is a powerful and versatile tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to utilize a high-level hardware description language, or HDL, to allow for the development of more complex applications. This chip model is an ideal choice for those who need a high-performance, feature-rich chip with a small form factor.


The XCZU7EV-2FBVB900I chip model is an advanced product that offers a wide range of features and capabilities. It is capable of handling complex algorithms and applications such as digital signal processing, embedded processing, and image processing. It also supports the development of sophisticated applications such as intelligent robots.


For the development and popularization of future intelligent robots, the XCZU7EV-2FBVB900I chip model is a great choice. It is capable of providing the necessary hardware and software capabilities to enable the development of sophisticated applications. Additionally, the chip is designed to work with a variety of programming languages, making it easier for developers to use the chip effectively.


In order to use the XCZU7EV-2FBVB900I chip model effectively, it is important to understand the product description and specific design requirements. It is also important to be familiar with the actual case studies and precautions that are associated with the chip. Additionally, it is beneficial to have a good understanding of the HDL language in order to use the chip model effectively.


Overall, the XCZU7EV-2FBVB900I chip model is a powerful and versatile tool that can be used for a variety of applications. It is an ideal choice for those who need a high-performance, feature-rich chip with a small form factor. Furthermore, the chip is capable of being used for the development and popularization of future intelligent robots. In order to use the chip model effectively, it is important to understand the product description and specific design requirements, as well as the actual case studies and precautions associated with the chip. Additionally, it is beneficial to have a good understanding of the HDL language.



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Unit Price: $1,919.5423
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,785.1743 $1,785.1743
10+ $1,765.9789 $17,659.7892
100+ $1,670.0018 $167,000.1801
1000+ $1,574.0247 $787,012.3430
10000+ $1,439.6567 $1,439,656.7250
The price is for reference only, please refer to the actual quotation!

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