AMD Xilinx
XCZU7EV-2FBVB900E
XCZU7EV-2FBVB900E ECAD Model
XCZU7EV-2FBVB900E Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 2.97 mm | |
| Width | 31 mm | |
| Length | 31 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA900,30X30,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2017-02-15 |
XCZU7EV-2FBVB900E Datasheet Download
XCZU7EV-2FBVB900E Overview
The chip model XCZU7EV-2FBVB900E is a powerful and versatile tool for developing high-performance digital signal processing, embedded processing, and image processing applications. It is designed with a high-performance architecture and is capable of powering a wide range of applications. It is also highly programmable, allowing users to customize their designs to meet their specific needs.
The original design intention of the chip model XCZU7EV-2FBVB900E is to provide a platform for high-performance digital signal processing, embedded processing, and image processing. It is capable of supporting a wide range of applications, including advanced communication systems. The model is designed with a scalable architecture that allows for future upgrades, making it an ideal platform for developing and deploying advanced communication systems.
The chip model XCZU7EV-2FBVB900E is also suitable for the development and popularization of future intelligent robots. It is capable of powering a wide range of robotic applications, including navigation, obstacle avoidance, and image recognition. To effectively use the model, users need to have a strong understanding of HDL (Hardware Description Language) programming and be familiar with the architecture of the chip model.
In conclusion, the chip model XCZU7EV-2FBVB900E is a powerful and versatile tool for developing high-performance digital signal processing, embedded processing, and image processing applications. It is designed with a scalable architecture that allows for future upgrades, making it an ideal platform for developing and deploying advanced communication systems. It is also suitable for the development and popularization of future intelligent robots. To effectively use the model, users need to have a strong understanding of HDL programming and be familiar with the architecture of the chip model.
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3,637 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,561.7186 | $1,561.7186 |
| 10+ | $1,544.9259 | $15,449.2592 |
| 100+ | $1,460.9626 | $146,096.2551 |
| 1000+ | $1,376.9992 | $688,499.5930 |
| 10000+ | $1,259.4505 | $1,259,450.4750 |
| The price is for reference only, please refer to the actual quotation! | ||