XCZU7EV-1FBVB900I
XCZU7EV-1FBVB900I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XCZU7EV-1FBVB900I


XCZU7EV-1FBVB900I
F20-XCZU7EV-1FBVB900I
Active
CMOS, BGA, BGA900,30X30,40
BGA, BGA900,30X30,40

XCZU7EV-1FBVB900I ECAD Model


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XCZU7EV-1FBVB900I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B900
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA900,30X30,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU7EV-1FBVB900I Datasheet Download


XCZU7EV-1FBVB900I Overview



The XCZU7EV-1FBVB900I chip model is a powerful and versatile FPGA that is ideal for applications requiring high-performance digital signal processing, embedded processing, and image processing. It is designed to be programmed in HDL (Hardware Description Language) and provides a range of features and benefits that make it an attractive choice for various industries.


The XCZU7EV-1FBVB900I chip model offers a high-speed processing capability, with a maximum clock frequency of 500MHz and a maximum operating frequency of 250MHz. It also offers a wide range of I/O options, with up to 8,192 I/Os, and various memory options, including DDR4, QDR, and RLDRAM. Furthermore, it offers a wide range of configurable logic blocks, including logic cells, DSP blocks, and memory blocks, to meet the needs of various applications.


In addition, the XCZU7EV-1FBVB900I chip model is designed to be highly reliable and efficient. It is designed to be power efficient, with low static and dynamic power consumption, and it is also designed to be secure, with advanced security features such as secure boot, secure configuration, and secure debug.


The XCZU7EV-1FBVB900I chip model has a wide range of potential applications, from high-end embedded systems to industrial automation and medical imaging. It is expected to be increasingly in demand in the coming years as more industries rely on FPGA technology for their needs.


When designing with the XCZU7EV-1FBVB900I chip model, it is important to consider the specific design requirements of the application. This includes understanding the specific requirements of the application in terms of speed, power, and security, as well as the specific design constraints of the chip model. It is also important to consider the specific HDL language used for programming the chip model, as well as the specific design tools used for programming and debugging.


In addition, it is important to consider actual case studies when designing with the XCZU7EV-1FBVB900I chip model. This includes understanding the specific design requirements and constraints of the application, as well as the specific design tools used to program and debug the chip model. It is also important to consider the specific design constraints of the chip model, such as power, speed, and security.


In conclusion, the XCZU7EV-1FBVB900I chip model is a powerful and versatile FPGA that is ideal for applications requiring high-performance digital signal processing, embedded processing, and image processing. It is designed to be programmed in HDL and offers a range of features and benefits that make it an attractive choice for various industries. When designing with the XCZU7EV-1FBVB900I chip model, it is important to consider the specific design requirements of the application, as well as actual case studies and design constraints of the chip model. It is expected to be increasingly in demand in the coming years as more industries rely on FPGA technology for their needs.



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Unit Price: $9,532.1862
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $8,864.9332 $8,864.9332
10+ $8,769.6113 $87,696.1130
100+ $8,293.0020 $829,300.1994
1000+ $7,816.3927 $3,908,196.3420
10000+ $7,149.1397 $7,149,139.6500
The price is for reference only, please refer to the actual quotation!

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