AMD Xilinx
XCZU7EV-1FBVB900E
XCZU7EV-1FBVB900E ECAD Model
XCZU7EV-1FBVB900E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA900,30X30,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU7EV-1FBVB900E Datasheet Download
XCZU7EV-1FBVB900E Overview
The XCZU7EV-1FBVB900E chip model is a high-performance, versatile and reliable solution for digital signal processing, embedded processing and image processing. It is designed with the latest technologies and the highest quality components to ensure that the chip can perform complex tasks with ease. The chip model is also compatible with the HDL language, allowing users to program the chip with greater flexibility and accuracy.
The XCZU7EV-1FBVB900E chip model is a great choice for those who need a powerful and reliable solution for digital signal processing and embedded processing. The chip model is designed to meet the latest industry trends and is capable of handling a wide range of tasks. It is also capable of supporting new technologies, such as advanced communication systems, which makes it a great choice for those looking to upgrade their current system.
The original design intention of the XCZU7EV-1FBVB900E chip model is to provide a powerful and reliable solution for digital signal processing, embedded processing and image processing. The chip model is designed with the latest technologies and the highest quality components to ensure that the chip can perform complex tasks with ease. The chip model is also compatible with the HDL language, allowing users to program the chip with greater flexibility and accuracy.
The XCZU7EV-1FBVB900E chip model is a great choice for those looking to upgrade their current system. It is designed to be upgradeable, meaning that users can add new features and technologies as needed. This makes the chip model a great choice for those looking to stay ahead of the latest industry trends.
In conclusion, the XCZU7EV-1FBVB900E chip model is a powerful, reliable and versatile solution for digital signal processing, embedded processing and image processing. It is designed with the latest technologies and the highest quality components to ensure that the chip can perform complex tasks with ease. The chip model is also compatible with the HDL language, allowing users to program the chip with greater flexibility and accuracy. The chip model is also upgradeable, meaning that users can add new features and technologies as needed. This makes the chip model a great choice for those looking to stay ahead of the latest industry trends.
You May Also Be Interested In
5,445 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,881.9995 | $1,881.9995 |
| 10+ | $1,861.7630 | $18,617.6297 |
| 100+ | $1,760.5802 | $176,058.0198 |
| 1000+ | $1,659.3974 | $829,698.7140 |
| 10000+ | $1,517.7416 | $1,517,741.5500 |
| The price is for reference only, please refer to the actual quotation! | ||