AMD Xilinx
XCZU7EG-L1FFVF1517I
XCZU7EG-L1FFVF1517I ECAD Model
XCZU7EG-L1FFVF1517I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 720 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | |
| Supply Voltage-Max | 742 mV | |
| Supply Voltage-Min | 698 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B1517 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FCBGA-1517 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU7EG-L1FFVF1517I Datasheet Download
XCZU7EG-L1FFVF1517I Overview
The XCZU7EG-L1FFVF1517I chip model is an advanced semiconductor device that is suitable for a variety of applications, such as high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language for programming. This chip model is designed to provide superior performance and reliability, making it suitable for a wide range of applications.
The XCZU7EG-L1FFVF1517I chip model offers several advantages over other models. It has a high-speed, low-power architecture that is designed to maximize performance while minimizing power consumption. It is also designed to be highly scalable, allowing it to be used in a variety of applications. Additionally, it is designed to be highly reliable, providing reliable operation in even the most demanding environments.
The XCZU7EG-L1FFVF1517I chip model is expected to be in high demand in the future, as the demand for advanced semiconductor devices continues to grow. This model is designed to meet the needs of a variety of industries, including automotive, aerospace, medical, and consumer electronics. As these industries continue to evolve, the XCZU7EG-L1FFVF1517I chip model is expected to remain a reliable and powerful solution for their needs.
The XCZU7EG-L1FFVF1517I chip model may require the support of new technologies in order to remain competitive in the future. As new technologies become available, the chip model may need to be adapted to take advantage of them. Additionally, the demand for the XCZU7EG-L1FFVF1517I chip model may increase as more industries begin to adopt advanced semiconductor devices.
In conclusion, the XCZU7EG-L1FFVF1517I chip model is an advanced semiconductor device that is suitable for a variety of applications. It offers superior performance, reliability, scalability, and low-power consumption, making it an ideal solution for a variety of industries. Additionally, the chip model may require the support of new technologies in order to remain competitive in the future, and the demand for the model is expected to increase as more industries adopt advanced semiconductor devices.
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1,839 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,719.1246 | $1,719.1246 |
| 10+ | $1,700.6394 | $17,006.3941 |
| 100+ | $1,608.2134 | $160,821.3357 |
| 1000+ | $1,515.7873 | $757,893.6510 |
| 10000+ | $1,386.3908 | $1,386,390.8250 |
| The price is for reference only, please refer to the actual quotation! | ||