
AMD Xilinx
XCZU7EG-3FFVF1517E
XCZU7EG-3FFVF1517E ECAD Model
XCZU7EG-3FFVF1517E Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 900 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Supply Voltage-Max | 927 mV | |
Supply Voltage-Min | 873 mV | |
Temperature Grade | OTHER | |
JESD-30 Code | R-PBGA-B1517 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1517 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA1517,39X39,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU7EG-3FFVF1517E Datasheet Download
XCZU7EG-3FFVF1517E Overview
The XCZU7EG-3FFVF1517E chip model is a powerful solution for today's increasingly complex and demanding computing needs. Developed by Xilinx, the chip model is designed to provide an optimal balance between performance and power consumption. It is the perfect choice for a wide range of applications, from embedded systems to high-end servers.
The XCZU7EG-3FFVF1517E chip model offers a wealth of features that make it an attractive choice for a variety of industries. It has a high-performance Zynq UltraScale+ MPSoC processor, which is capable of delivering up to 3.5 TFLOPS of computing power. It also features a high-speed DDR4 memory, a high-speed PCIe Gen4 x16 interface, and a variety of I/O capabilities. All of these features make it well suited for a variety of applications, from data centers to embedded systems.
The XCZU7EG-3FFVF1517E chip model is expected to experience increased demand in the near future, as more industries are turning to high-performance computing solutions. The chip model is particularly well suited for applications such as machine learning, artificial intelligence, and 5G networks. This is due to its high performance, low power consumption, and wide range of I/O capabilities.
The XCZU7EG-3FFVF1517E chip model was designed with the intention of providing a powerful, yet flexible solution. It is possible to upgrade the chip model in the future, allowing it to keep up with the ever-evolving computing needs of the industry. This makes it a great choice for applications that require a high degree of flexibility.
The XCZU7EG-3FFVF1517E chip model has the potential to be used in a variety of applications, from networks to intelligent systems. It is capable of being used in the era of fully intelligent systems, as it is able to support a wide range of I/O capabilities. This makes it an attractive choice for a variety of intelligent scenarios, such as autonomous vehicles, IoT networks, and smart homes.
In conclusion, the XCZU7EG-3FFVF1517E chip model is an ideal choice for a variety of industries, with its high performance, low power consumption, and wide range of I/O capabilities. It is expected to experience increased demand in the near future, and can be upgraded in the future to keep up with changing computing needs. Furthermore, it has the potential to be used in a variety of applications, from networks to intelligent systems, making it an attractive choice for a variety of intelligent scenarios.
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3,280 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $2,394.4298 | $2,394.4298 |
10+ | $2,368.6832 | $23,686.8324 |
100+ | $2,239.9505 | $223,995.0459 |
1000+ | $2,111.2177 | $1,055,608.8370 |
10000+ | $1,930.9918 | $1,930,991.7750 |
The price is for reference only, please refer to the actual quotation! |